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Mohamad-Nour Nashed
Advanced Textiles Research Group, Nottingham Trent University, Nottingham, UK

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Technical paper
Published: 04 March 2019 in Microsystem Technologies
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Wider adoption of electronic textiles requires integration of small electronic components into textile fabrics, without comprising the textile qualities. A solution is to create a flexible yarn that incorporates electronic components within the fibres of the yarn (E-yarn). The production of these novel E-yarns was initially a craft skill, with the inclusion of package dies within the fibres of the yarn taking about 90 min. The research described here demonstrated that it is possible to produce E-yarns on an industrial scale by automating the manufacturing process. This involved adapting printed circuit board manufacturing technology and textile yarn covering machinery. The production process started with re-flow soldering of package dies onto fine multi-strand copper wire. A carrier yarn was then placed in parallel with the copper wire to provide tensile strength. The package die and adjacent carrier yarn were then encapsulated in a polymer micro-pod to provide protection from moisture ingress and from mechanical strain on the die and solder joints. The process was then completed by surrounding the micro-pod and copper interconnects with additional fibres, held tightly together with a knitted fibre-sheath. This prototype, automated production process reduced the time for embedding one micro-device within a yarn to 6 min, thus increasing the production speed, demonstrating that automation of the E-yarn production process is feasible. Prototype garments have been created using E- yarns. Further developments can include automated transfer of the yarn components from one stage of production to the next, enabling greater increases in speed of manufacture of E yarns.

ACS Style

Dorothy Anne Hardy; Ioannis Anastasopoulos; Mohamad-Nour Nashed; Carlos Oliveira; Theodore Hughes-Riley; Abiodun Komolafe; John Tudor; Russel Torah; Steve Beeby; Tilak Dias. Automated insertion of package dies onto wire and into a textile yarn sheath. Microsystem Technologies 2019, 1 -13.

AMA Style

Dorothy Anne Hardy, Ioannis Anastasopoulos, Mohamad-Nour Nashed, Carlos Oliveira, Theodore Hughes-Riley, Abiodun Komolafe, John Tudor, Russel Torah, Steve Beeby, Tilak Dias. Automated insertion of package dies onto wire and into a textile yarn sheath. Microsystem Technologies. 2019; ():1-13.

Chicago/Turabian Style

Dorothy Anne Hardy; Ioannis Anastasopoulos; Mohamad-Nour Nashed; Carlos Oliveira; Theodore Hughes-Riley; Abiodun Komolafe; John Tudor; Russel Torah; Steve Beeby; Tilak Dias. 2019. "Automated insertion of package dies onto wire and into a textile yarn sheath." Microsystem Technologies , no. : 1-13.

Journal article
Published: 26 January 2019 in Fibers
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Electronic yarns (E-yarns) contain electronics fully incorporated into the yarn’s structure prior to textile or garment production. They consist of a conductive core made from a flexible, multi-strand copper wire onto which semiconductor dies or MEMS (microelectromechanical systems) are soldered. The device and solder joints are then encapsulated within a resin micro-pod, which is subsequently surrounded by a textile sheath, which also covers the copper wires. The encapsulation of semiconductor dies or MEMS devices within the resin polymer micro-pod is a critical component of the fabrication process, as the micro-pod protects the dies from mechanical and chemical stresses, and hermetically seals the device, which makes the E-yarn washable. The process of manufacturing E-yarns requires automation to increase production speeds and to ensure consistency of the micro-pod structure. The design and development of a semi-automated encapsulation unit used to fabricate the micro-pods is presented here. The micro-pods were made from a ultra-violet (UV) curable polymer resin. This work details the choice of machinery and methods to create a semi-automated encapsulation system in which incoming dies were detected then covered in resin micro-pods. The system detected incoming 0402 metric package dies with an accuracy of 87 to 98%.

ACS Style

Mohamad-Nour Nashed; Dorothy Hardy; Theodore Hughes-Riley; Tilak Dias. A Novel Method for Embedding Semiconductor Dies within Textile Yarn to Create Electronic Textiles. Fibers 2019, 7, 12 .

AMA Style

Mohamad-Nour Nashed, Dorothy Hardy, Theodore Hughes-Riley, Tilak Dias. A Novel Method for Embedding Semiconductor Dies within Textile Yarn to Create Electronic Textiles. Fibers. 2019; 7 (2):12.

Chicago/Turabian Style

Mohamad-Nour Nashed; Dorothy Hardy; Theodore Hughes-Riley; Tilak Dias. 2019. "A Novel Method for Embedding Semiconductor Dies within Textile Yarn to Create Electronic Textiles." Fibers 7, no. 2: 12.