The electrochemical additive manufacturing technique based on the meniscus-confined approach has been proved to be a powerful tool for fabricating nanoscale and microscale metal components. The stability of the meniscus is the key in this meniscus-confined approach to achieve high resolution and reliable product quality. In the present study, a double-nozzles design, which consists of a feed nozzle and a suction nozzle, is proposed for the meniscus confined electrochemical additive manufacturing technique. It was demonstrated that the proposed design possessed robust control of the stability of the meniscus by manipulating the feed and suction rates of the two nozzles in a quite large range. Various sizes of menisci can be easily obtained by utilising nozzles with different sizes. Compared with the pressure-controlled single-nozzle approach, the results showed that dense structures without dendrites can be fabricated by the double-nozzles design with larger current density due to the feed-and-suction process at the tip of the nozzles. The proposed flow-rate-controlled double-nozzles design was finally employed to fabricate some copper circuits and a Cu/CuNi thin film thermocouple to demonstrate its potential in fabricating electronic devices.

For the additive manufacturing (AM) of metal objects, the powder-based fusion (PBF) method is routinely utilized to fabricate macroscale parts. On the other hand, electrochemical additive manufacturing (ECAM), in which metallic structures are deposited through the electrochemical reduction of metal ions, is a promising technique for producing micro- and nanoscale objects. However, a gap exists in terms of fabricating mesoscale objects within the current AM techniques. The PBF method is limited by fabrication precision due to pronounced residual stresses, and most current ECAM systems are difficult to scale up to print mesoscale objects. In the present paper, the novel design of a low-cost ECAM 3D printer based on a microfluidic system is proposed for fabricating mesoscale metal parts. The meniscus-guided electrodeposition approach is utilized, in which a meniscus is formed between the print head and substrate, and electrodeposition is confined within the meniscus. A 3D object is fabricated by the meniscus moving with the print head according to the programmed pattern and the material subsequently being deposited at the designated locations. The key to the proposed design is to maintain a mesoscale meniscus, which normally cannot be sustained by the electrolyte surface tension with a print nozzle having a mesoscale diameter. Therefore, a microfluidic system, called the fountain pen feed system, constituting a semi-open main channel and comb structure, was designed to maintain a mesoscale meniscus throughout the printing process. Two materials, copper and nickel, with various geometric shapes were attempted to print by the proposed ECAM system, and, during the printing process, both fluid leaking and meniscus breaking were completely prevented. Free standing tilted copper pillars with controlled angles were printed to show the ability of the proposed design in fabricating 3D structures. A copper circuit was also printed on a non-conductive substrate to demonstrate a possible application of the proposed ECAM system in the fabrication of functional electronics.

In additive manufacturing of metallic materials, an accurate description of the thermal histories of the built part is important for further analysis of the distortions and residual stresses, which is a big issue for additively manufactured metal products. In the present paper, a computationally volumetric heat source model based on a semianalytical thermal modeling approach is proposed. The proposed model is applied to model the thermal response during a selective laser melting (SLM) process. The interaction between the laser and the material is described using a moving volumetric heat source. High computational efficiency can be achieved with considerable accuracy. Several case studies are conducted to examine the accuracy of the proposed model. By comparing with the experimentally measured melt-pool dimensions, it is found that the error between the predictions obtained by the proposed model and the experimental results can be controlled to less than 10%. High computational efficiency can also be achieved for the proposed model. It is shown that for simulating the thermal process of scanning a single layer with the dimension of 2 mm × 2 mm, the calculation can be finished in around 110 s.

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