Hongyu Zhou

Dr. Hongyu Zhou

orcid

Research Focus & Metrics

Academic Career Length

11Years (2016-Present)

(Calculated once Scilit publication data is synced: current year − year of first publication + 1)

Representative Publications

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10 July 2022 in International Journal of Hydrogen Energy
Verified
Journal Article
Closed access
HWHantong Wang
Hantong Wang
ZTZhi Tong
Zhi Tong
GZGuijuan Zhou
Guijuan Zhou
CZCi Zhang
Ci Zhang
HZHongyu Zhou
Hongyu Zhou
WZWenyue Zheng
Wenyue Zheng

1 September 2018 in Journal of Alloys and Compounds
Verified
Journal Article
Closed access
HZHongyu Zhou
Hongyu Zhou
XLXin Liu
Xin Liu
ZYZheng Yin
Zheng Yin
YLYaqiang Li
Yaqiang Li
CLChang Liu
Chang Liu
JLJunyou Liu
Junyou Liu

17 October 2023 in International Journal of Hydrogen Energy
Verified
Journal Article
Closed access
HZHongyu Zhou
Hongyu Zhou
XSXiaoran Sun
Xiaoran Sun
ZTZhi Tong
Zhi Tong
GCGuo Cheng
Guo Cheng
BXBingbing Xu
Bingbing Xu
XCXiaohua Chen
Xiaohua Chen

22 January 2021 in Metals
Verified
Journal Article
Open access
PDF file
YLYaqiang Li
Yaqiang Li
HZHongyu Zhou
Hongyu Zhou
CWChunjing Wu
Chunjing Wu
ZYZheng Yin
Zheng Yin
CLChang Liu
Chang Liu
ZSZhongliang Shi
Zhongliang Shi
The coefficients of thermal expansion (CTE) and thermal conductivity (TC) are important for heat sink applications, as they can minimize stress between heat sink substrates and chips and prevent failure from thermal accumulation in electronics. We investigated the interface behavior and manufacturing of diamond/Cu composites and found that they have much lower TCs than copper due to their low densities. Most defects, such as cavities, form around diamond particles, substantially decreasing the high TC of diamond reinforcements. However, the measurement results for the Cu-coated diamond/Cu composites are unsatisfactory because the nanosized copper layer on the diamond surface grew and spheroidized at elevated sintering temperatures. Realizing ideal interfacial bonding between a copper matrix and diamond particles is difficult. The TC of the 40 vol.% Ti-coated diamond/Cu composite is 475.01 W m−1 K−1, much higher than that of diamond/Cu and Cu-coated diamond/Cu composites under equivalent manufacturing conditions. The minimally grown titanium layer retained its nanosized and was consistent with the sintering temperature. Depositing a nanosized titanium layer on a diamond surface will strengthen interfacial bonding through interface reactions among the copper matrix, nanosized titanium layer and diamond particles, reducing the interfacial thermal resistance and exploiting the high TC of diamond particles, even if defects from powder metallurgy remain. These results provide an important experimental and theoretical basis for manufacturing diamond/Cu composites for heat sink applications.

17 April 2024 in Materials
Verified
Journal Article
Open access
PDF file
ZTZhi Tong
Zhi Tong
HWHantong Wang
Hantong Wang
Wenyue ZhengWenyue Zheng
Wenyue Zheng
HZHongyu Zhou
Hongyu Zhou
Medium-carbon, high-strength steels are widely used in the field of hydrogen energy because of their good mechanical properties, and they can be readily tailored by heat treatment processes such as the normalizing–tempering (N&T) and quenching–tempering (Q&T) methods. The hydrogen embrittlement (HE) susceptibility of a medium-carbon, high-strength steel was investigated utilizing microstructural characterization with scanning electron microscopy (SEM), the electron backscatter diffraction (EBSD) technique, and transmission electron microscopy (TEM). A study was also conducted on the steel’s hydrogen transport behavior as affected by the N&T and Q&T treatments. The steel contained more hydrogen traps, such as dislocations, grain boundaries, lath boundaries, and carbide interfaces, after the Q&T process, which was associated with a lower HE sensitivity when comparing the two treatments. In comparison, the N&T process produced larger-size and lesser-density carbides distributed along the grain boundaries, and this resulted in a relatively higher HE susceptibility, as revealed by the slow-strain-rate tensile (SSRT) tests of the hydrogen-charged steels and by the fractographic study of the fracture surface.

29 October 2020 in Metals
Verified
Journal Article
Open access
PDF file
KWKangnian Wang
Kangnian Wang
HWHuimin Wang
Huimin Wang
HZHongyu Zhou
Hongyu Zhou
Wenyue ZhengWenyue Zheng
Wenyue Zheng
AXAijun Xu
Aijun Xu
The demands for the connection between thin dissimilar and similar materials in the fields of microelectronics and medical devices has promoted the development of laser impact welding. It is a new solid-state metallurgical bonding technology developed in recent years. This paper reviews the research progress of the laser impact welding in many aspects, including welding principle, welding process, weld interface microstructure and performance. The theoretical welding principle is the atomic force between materials. However, the metallurgical combination of two materials in the solid state by atomic force but almost no diffusion has not been confirmed by microstructure observation. The main theories used to explain the wave formation in impact welding were compared to conclude that caved mechanism and the Helmholz instability mechanism were accepted by researchers. The rebound of the flyer is still a critical problem for its application. With proper control of the welding parameters, the weld failure occurs on the base materials, indicating that the weld strength is higher than that of the base materials. Laser impact welding has been successfully applied in joining many dissimilar materials. There are issues still remained unresolved, such as surface damage of the flyer. The problems faced by laser impact welding were summaried, and its future applications were proposed. This review will provide a reference for the studies in laser impact welding, aiming process optimization and industrial application.