Hard brittle materials (e.g. glasses and ceramics) increasingly appeal to general interests because of their excellent physical, mechanical and chemical properties such as super hardness and strength at extreme temperature and chemical stability. The precision manufacturing of these materials is primarily achieved by grinding and polishing, which generally employs abrasives to wear the materials. With this manufacturing technology, the materials are removed due principally to the fracture of brittle materials, which will leave a cracked layer on the surface of manufactured components, namely subsurface damage (SSD). The subsurface damage affects the strength, performance and lifetime of components. As a result, investigation into the subsurface damage is needed. A host of characterizing techniques have been developed during the past several decades. These techniques based on different mechanisms provide researchers with invaluable information on the subsurface damage in various materials. In this article the typical SSD evaluation techniques are reviewed, which are regularly used in optical workshops or laboratories.

The effect of polishing an optical workpiece with a polyurethane pad was studied in this paper, including material removal rate, surface roughness and subsurface damage. Usually, optical polishing pitch is applied to polish optical workpieces, but the material removal rate (MRR) of pitch is quite low, and polyurethane foam is thus substituted for polishing pitch. With the polyurethane pad a much higher MRR was obtained. Surface roughness and subsurface damage of workpieces were also examined. We were gratified to find that there was almost no subsurface damage in the workpieces manufactured with pad polishing and surface roughness was comparable to the result of pitch polishing. Finally, a hypothesis was proposed in an attempt to explain the result that workpieces were defect-free.

An alternative method for evaluating subsurface damage (SSD) in ground fused silica is presented. The method can acquire the knowledge of depth and morphology of subsurface damage at the same time. The fundamental support lent to the method is the fact that the depth of field reduces as the numerical aperture (NA)/magnification increases in optical microscopes. Large depth of field without undermining NA is preferred in most applications while the narrow range of focus depth is desired for our method. Using this method, we experimented on fused silica which was ground with bound-abrasive diamond wheels and the results show good agreement with the traditional method. The consistency indicates that the proposed method is practicable and effective in inspecting the subsurface damage in optical components.

HF-based (hydrofluoric acid) chemical etching has been a widely accepted technique to improve the laser damage performance of fused silica optics and ensure high-power UV laser systems at designed fluence. Etching processes such as acid concentration, composition, material removal amount, and etching state (etching with additional acoustic power or not) may have a great impact on the laser-induced damage threshold (LIDT) of treated sample surfaces. In order to find out the effects of these factors, we utilized the Taguchi method to determine the etching conditions that are helpful in raising the LIDT. Our results show that the most influential factors are concentration of etchants and the material etched away from the viewpoint of damage performance of fused silica optics. In addition, the additional acoustic power ($\sim 0.6\mathrm{W}·{\mathrm{cm}}^{-2}$) may not benefit the etching rate and damage performance of fused silica. Moreover, the post-cleaning procedure of etched samples is also important in damage performances of fused silica optics. Different post-cleaning procedures were, thus, experiments on samples treated under the same etching conditions. It is found that the “spraying + rinsing + spraying” cleaning process is favorable to the removal of etching-induced deposits. Residuals on the etched surface are harmful to surface roughness and optical transmission as well as laser damage performance.

Scratches in fused silica are notorious laser damage precursors to UV laser damage initiation. Ductile and brittle scratches were intentionally generated using various polishing slurries. The distribution, profile and the dimension of scratches were characterized. The damage resistance of polished surfaces was evaluated using raster scanning damage testing protocol. The results show that both ductile and brittle scratches greatly increase area proportion of laser damage about one to two orders of magnitude relative to unscratched surface and brittle scratches are more deleterious. Moreover, finite difference time domain (FDTD) simulation was used to numerically calculate the light field distribution around scratches on rear surface (i.e. exit surface for light) which indicates that modulated light intensity is susceptible to the profile and size of scratches. FDTD simulation results also indicate that the light field intensification is elevated with the dimension of scratches and light modulation effects in triangular scratches are usually not as notable as serrated and parabolic scratches.