The complementary metal oxide semiconductor (CMOS) microbolometer technology provides a low-cost approach for the long-wave infrared (LWIR) imaging applications. The fabrication of the CMOS-compatible microbolometer infrared focal plane arrays (IRFPAs) is based on the combination of the standard CMOS process and simple post-CMOS micro-electro-mechanical system (MEMS) process. With the technological development, the performance of the commercialized CMOS-compatible microbolometers shows only a small gap with that of the mainstream ones. This paper reviews the basics and recent advances of the CMOS-compatible microbolometer IRFPAs in the aspects of the pixel structure, the read-out integrated circuit (ROIC), the focal plane array, and the vacuum packaging.

The growing need for the multiband photodetection of a single scene has promoted the development of both multispectral coupling and broadband detection technologies. Photodetectors operating across the infrared (IR) to terahertz (THz) regions have many applications such as in optical communications, sensing imaging, material identification, and biomedical detection. In this review, we present a comprehensive overview of the latest advances in broadband photodetectors operating in the infrared to terahertz range, highlighting their classification, operating principles, and performance characteristics. We discuss the challenges faced in achieving broadband detection and summarize various strategies employed to extend the spectral response of photodetectors. Lastly, we conclude by outlining future research directions in the field of broadband photodetection, including the utilization of novel materials, artificial microstructure, and integration schemes to overcome current limitations. These innovative methodologies have the potential to achieve high-performance, ultra-broadband photodetectors.

A terahertz metamaterial absorber with broadband characteristics, leveraging the phase transition properties of vanadium dioxide (VO₂), is proposed. In comparison to existing terahertz absorbers, the design presented in this study demonstrates a reduced thickness, an expanded tunable range, and a broader bandwidth. Simulation results indicate that with a VO₂ conductivity of 200,000 S/m, the absorber achieves a bandwidth of 6.35 THz, spanning from 2.82 THz to 9.17 THz. We analyzed the impact of structural parameters on the absorption rate and further employed impedance matching theory, electric field distribution, and surface current distribution to elucidate the underlying physical mechanisms of absorption. Additionally, the absorber exhibits polarization insensitivity and wide-angle absorption characteristics. Notably, the proposed absorber demonstrates tunable features, with the absorption peak adjustable from approximately 2–100% by varying the conductivity of VO₂ from 200 S/m to 200,000 S/m. This terahertz broadband absorber holds significant potential for applications in terahertz imaging, stealth technology, and communication systems.

The metal-type microbolometers in CMOS technology normally suffer low resistivity and high thermal conductivity, limiting their performance and application areas. In this paper, we demonstrate a polysilicon microbolometer fabricated in 0.18 µm CMOS and post-CMOS processes. The detector is composed of a SiO₂ absorber coupled with a salicided poly-Si thermistor that has a high resistivity of 1.37×10⁻⁴ Ω·cm and low thermal conductivity of 18 W/m·K. It is experimentally shown that the microbolometer with a 40 µm × 40 µm pixel size has a maximum responsibility and detectivity of 2.13×10⁴ V/W and 2.33×10⁹ cmHz^1/2/W, respectively. The results are superior to the reported metal-type and diode-type microbolometers in the CMOS process and provide good potential for a low-cost, high-performance, uncooled microbolometer array for infrared imaging applications.

In this paper, the chemical vapor deposition (CVD) processing for 4H-SiC epilayer is investigated with particular emphasis on the defects and the noise properties. It is experimentally found that the process parameters of C/Si ratio strongly affect the surface roughness of epilayers and the density of triangular defects (TDs), while no direct correlation between the C/Si ratio and the deep level defect Z_1/2 could be confirmed. By adjusting the C/Si ratio, a decrease of several orders of magnitudes in the noise level for the 4H-SiC Schottky barrier diodes (SBDs) could be achieved attributing to the improved epilayer quality with low TD density and low surface roughness. The work should provide a helpful clue for further improving the device performance of both the 4H-SiC SBDs and the Schottky barrier ultraviolet photodetectors fabricated on commercial 4H-SiC wafers.