Casali Center for Applied Chemistry, Institute of Chemistry, Faculty of Mathematics and Sciences, The Hebrew University of Jerusalem, Jerusalem, Israel
Dr. Alexander Kamyshny
Casali Center for Applied Chemistry, Institute of Chemistry, Faculty of Mathematics and Sciences, The Hebrew University of Jerusalem, Jerusalem, Israel
The effect of polydispersity of nickel-silver core-shell nanoparticles (Ni-Ag NPs) on the conductivity of ink coatings was studied. Ni-Ag NPs of various average diameters (100, 220, and 420 nm) were synthesized and utilized for the preparation of conductive inks composed of monodisperse NPs and their polydisperse mixtures. The shell thickness of synthesized Ni-Ag NPs was found to be in the range of 10–20 nm and to provide stability of a core metal to oxidation for at least 6 months. The conductivity of metallic films formed by inks with monodisperse Ni-Ag NPs was compared with those formed by polydisperse inks. In all cases, the optimal conditions for the formation of conductive patterns (weight ratio of monodisperse NPs for polydisperse composition, the concentration of the wetting agent, sintering temperature, and duration) were determined. It was found that metallic films formed by polydisperse ink containing 100, 220, and 420 nm Ni-Ag NPs with a mass ratio of 1:1.5:0.5, respectively, are characterized by the lowest resistivity, 10.9 µΩ·cm, after their thermal post-coating sintering at 300 °C for 30 min that is only 1.6 higher than that of bulk nickel.
Low-cost metallic nanoink based on nickel–silver core–shell nanoparticles (Ni@Ag NPs) was used for the formation of conductive metallic coatings with low sintering temperature, which can be successfully applied for replacement of currently used silver-based nanoinks in printed electronics. The effect of oxalic acid (OA) on the sintering temperature and conductivity of coatings formed by Ni@Ag NPs was evaluated. It was found that the addition of OA to the ink formulation and post-printing treatment of deposited films with this acid provided a noticeable decrease in the sintering temperature required for obtaining conductive patterns that is especially important for utilizing the polymeric substrates. The obtained resistivity of metallic coatings after sintering at temperature as low as 100 °C was found to be 30 µΩ·cm, only ~4 times higher compared to the resistivity of bulk Ni that is promising for future application of such materials for fabrication of low-cost flexible printed patterns.