Xuemei Li

Mrs. Xuemei Li

School of Mechanical and Electronic Engineering

Research Focus & Metrics

Academic Career Length

31Years (1996-Present)

(Calculated once Scilit publication data is synced: current year − year of first publication + 1)

Representative Publications

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21 April 2020 in Future Medicinal Chemistry
Verified
Journal Article
Closed access
LTLexian Tong
Lexian Tong
XLXuemei Li
Xuemei Li
YHYongzhou Hu
Yongzhou Hu
TLTao Liu
Tao Liu
Fms-like tyrosine kinase-3 (FLT3) mutations occur in approximately 30% of acute myeloid leukemia (AML) cases, suggesting FLT3 as an attractive target for AML treatment. Early FLT3 inhibitors enhanc...

1 May 2015 in Transactions of Nonferrous Metals Society of China
Verified
Journal Article
Closed access
XLXuemei Li
Xuemei Li
FSFeng-Lian Sun
Feng-Lian Sun
HZHao Zhang
Hao Zhang
XTXin Tong
Xin Tong

10 March 2024 in Crystals
Verified
Journal Article
Open access
PDF file
XKXiangxia Kong
Xiangxia Kong
JZJunjun Zhai
Junjun Zhai
RMRuipeng Ma
Ruipeng Ma
FSFenglian Sun
Fenglian Sun
XLXuemei Li
Xuemei Li
Sn58Bi solder is considered a promising lead-free solder that meets the performance requirements, with the advantages of good wettability and low cost. However, the low melting point characteristic of Sn58Bi poses a serious threat to the high-temperature reliability of electronic products. In this study, Sn58Bi solder alloy based on nickel (Ni) functionalization was successfully synthesized, and the effect of a small amount of Ni on creep properties and hardness of Cu/Sn58Bi/Cu micro solder joints at different temperatures (25 °C, 50 °C, 75 °C, 100 °C) was investigated using a nanoindentation method. The results indicate that the nanoindentation depth of micro solder joints exhibits a non-monotonic trend with increasing Ni content at different temperatures, and the slope of the indentation stage curve decreases at 100 °C, showing that the micro solder joints undergo high levels of softening. According to the observation of indentation morphology, Ni doping can reduce the indentation area and accumulation around the indentation, especially at 75 °C and 100 °C. In addition, due to the severe creep phenomenon at 100 °C, the indentation hardness rapidly decreases. The indentation hardness values of micro solder joints of Cu/Sn58Bi/Cu, Cu/Sn58Bi-0.1Ni/Cu, and Cu/Sn58Bi-0.2Ni/Cu at 100 °C are 14.67 ± 2.00 MPa, 21.05 ± 2.00 MPa, and 20.13 ± 2.10 MPa, respectively. Nevertheless, under the same temperature test conditions, the addition of Ni elements can improve the high-temperature creep resistance and hardness of Cu/Sn58Bi/Cu micro solder joints.

1 November 1996 in Semiconductor Science and Technology
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Journal Article
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GDGuotong Du
Guotong Du
KSKathleen A Stair
Kathleen A Stair
GDGregory Devane
Gregory Devane
Jian-Ping ZhangJian-Ping Zhang
Jian-Ping Zhang
RCR P H Chang
R P H Chang
YLYing Liu
Ying Liu
We have devised a novel vertical-cavity surface-emitting laser structure. The epitaxial layers have been grown by molecular beam epitaxy (MBE). The bottom mirror consists of 30.5 pairs of multilayer distributed Bragg reflector (DBR). The top mirror is a hybrid reflector consisting of 8.5 pairs of multilayer and a semi-transparent metal film. The structure is obtained by two He ion implantations using tungsten wires as an implant mask. The lowest threshold current is 8.2 mA, and the highest peak light output power is 1.8 mW under room-temperature cw conditions.

8 April 2022 in Materials
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Journal Article
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MLMeng Liu
Meng Liu
MLMeng Liu
Meng Liu
LBLi Bao
Li Bao
XLXuemei Li
Xuemei Li
The quality of threaded connection is an important factor affecting the service life of equipment. Extruded thread has stronger mechanical properties than traditional cutting thread. The forming of magnesium alloy AZ91D internal thread by electromagnetic induction heating assisted extrusion is a new processing method. In this work, on the basis of this process, the height and performance of internal thread are selected as the evaluation index, and the response surface method is used to analyze the influence of the process parameters on the internal thread performance. The range of process parameters (auxiliary heating temperature, hole diameter, machine tool speed) is determined by slip line and empirical method, the test data are simulated, modeled and compared with the response surface analysis method, and the best mathematical model is selected to establish the regression model, the three-dimensional response surface curve of tooth height rate and maximum tensile force is obtained. Through simulation and prediction, it is found that the hole diameter and auxiliary heating temperature have significant influence on the tooth height rate and maximum tensile force of internal thread, and the order is that the hole diameter is larger than the auxiliary heating temperature than the machine tool speed. The research results show that the measured value of tooth height rate and maximum tensile force are close to the predicted value, and the errors are 1.8% and 2.7% respectively, and the model fits well. The better forming process parameters are as follows: auxiliary heating temperature to be 220 °C, hole diameter to be 11.35 mm, machine tool speed to be200 r/min. under this parameter, the tooth height rate and maximum tensile force to be 89.056% and 38.824 KN. At the same time, it is found that with the increase of thread height, the maximum tensile force of thread is also increasing, and the thread height affects the performance of thread. Finally, the optimal process parameters are obtained by response surface method, which improves the tensile properties of extruded internal threads.

21 June 2021 in Journal of Electronic Materials
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Journal Article
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XLXuemei Li
Xuemei Li
ZLZihao Liu
Zihao Liu
CLCheng Li
Cheng Li
YGYuXin Guo
YuXin Guo
DWDawei Wang
Dawei Wang
RFRui Fan
Rui Fan