This paper describes the realization and characterization of microwave 3-D printed loads in rectangular waveguide technology. Several commercial materials were characterized at X-band (8-12 GHz). Their dielectric properties were extracted through the use of a cavity-perturbation method and a transmission/reflection rectangular waveguide method. A lossy carbon-loaded Acrylonitrile Butadiene Styrene (ABS) polymer was selected to realize a matched load between 8 and 12 GHz. Two different types of terminations were realized by fused deposition modeling: a hybrid 3-D printed termination (metallic waveguide + pyramidal polymer absorber + metallic short circuit) and a full 3-D printed termination (self-consistent matched load). Voltage standing wave ratio of less than 1.075 and 1.025 were measured over X-band for the hybrid and full 3-D printed terminations, respectively. Power behavior of the full 3-D printed termination was investigated. A very linear evolution of reflected power as a function of incident power amplitude was observed at 10 GHz up to 11.5 W. These 3-D printed devices appear as a very low cost solution for the realization of microwave matched loads in rectangular waveguide technology.
9 July 2020 in IEEE Transactions on Electromagnetic Compatibility
In this article, we propose to apply 3-D printing technology to the design and realization of honeycomb microwave absorbers. First, printability of simple honeycomb structures, made of a lossy dielectric material, was evaluated and validated by measurement in the 2–18 GHz frequency band. Effective dielectric properties of honeycomb structures with different dimensions are also discussed. Then, the interest of 3-D printing technology was highlighted by the design, fabrication, and measurement of a multiscale honeycomb absorber that can significantly increase the relative bandwidth. The 3-D printed honeycomb absorbers are compared with others technologies. The potential of this technology was also illustrated by the fabrication and measurement of a pyramidal honeycomb absorber that demonstrates an absorption level of more than 22.9 dB over the 2–18 GHz frequency band.
With the multiplication of electronic devices in our daily life, there is a need for tailored wideband electromagnetic (EM) absorbers that could be conformed on any type of surface-like antennas for interference attenuation or military vehicles for stealth applications. In this study, a wideband flexible flat electromagnetic absorber compatible with additive manufacturing has been studied in the X-Ku frequency bands. A multilayer structure has been optimized using a genetic algorithm (GA), adapting the restrictions of additive manufacturing and exploiting the EM properties of loaded and non-loaded filaments, of which the elaboration is described. After optimization, a bi-material multilayer absorber with a thickness of 4.1 mm has been designed to provide a reflectivity below −12 dB between 8 and 18 GHz. Finally, the designed multilayer structure was 3D-printed and measured in an anechoic chamber, achieving −11.8 dB between 7 and 18 GHz. Thus, the development of dedicated materials has demonstrated the strong potential of additive technologies for the manufacturing of thin wideband flexible EM absorbers.
26 December 2006 in IEEE Transactions on Ultrasonics, Ferroelectrics, and Frequency Control
In this study about the relationships between structural and microwave electrical properties of KTa1-xNbxO3 (KTN) ferroelectric materials, a KTN thin film was deposited on different substrates to investigate how KTN growth affects the microwave behavior. Interdigital capacitors and stubs were made on these films through a simple engraving process. Microwave measurements under a static electric field showed the importance of the substrate on the circuit behavior and, notably, on the tuning factor
2 February 2021 in IEEE Transactions on Microwave Theory and Techniques
This article presents the design and fabrication of a microstrip C-band microwave isolator using additive technology. Such fabrication requires multimaterial 3-D printing (dielectric and absorber) and the embedding of ferrite ceramic inside the substrate. First, our design demonstrated that an efficient microstrip load can be made by 3-D printing in a single process: not only the dielectric but also the absorber, which takes the form of steps in the substrate. Then, a circulator with a composite dielectric/ferrite resonator was designed. Finally, circulator and load were integrated in a single component to optimize the isolator. The device was then 3-D-printed with a pause during the fabrication to allow the ferrite disk to be embedded. Microwave measurements demonstrated that minimum insertion losses of 0.76 dB were achieved, together with a -15 dB bandwidth of 11.9%. To our knowledge, this is the first demonstration of the feasibility of fabricating a non-reciprocal microwave component by additive technology.