Polymer composites with enhanced thermal and dielectric properties can be widely used in electric and energy related applications. In this work, epoxy composites have been prepared with Ti₃C₂T_x, one of the most studied MXene materials that can be massively produced by direct etching using hydrofluoric acid. The addition of conductive two dimensional Ti₃C₂T_x platelet fillers leads to improved but anisotropic thermal conductivity of the composites. The through-plane thermal conductivity reaches 0.583 Wm⁻¹K⁻¹ and the in-plane thermal conductivity reaches 1.29 Wm⁻¹K⁻¹ when filler content is 40 wt% (21.3 vol%), achieving enhancements of 2.92 times and 10.65 times respectively, as compared with epoxy matrix. The dielectric permittivity of epoxy composite is enhanced by a factor of ~2.25 with 40 wt% fillers, and the dielectric losses are within a small value of 0.02. The results prove the effectiveness of Ti₃C₂T_x in simultaneously improving thermal and dielectric performance of epoxy composites, and it is deduced that further improvements may be obtained by using Ti₃C₂T_x nanoflake fillers.