The rail fastening system is an important part of a high-speed railway track. It is always critical to the operational safety and comfort of railway vehicles. Therefore, the condition detection of the rail fastening system, looseness or absence, is an important task in railway maintenance. However, the vision-based method cannot identify the severity of rail fastener looseness. In this paper, the condition of rail fastening system is monitored based on an automatic and remote-sensing measurement system. Meanwhile, wavelet packet analysis is used to analyze the acceleration signals, based on which two damage indices are developed to locate the damage position and evaluate the severity of rail fasteners looseness, respectively. To verify the effectiveness of the proposed method, an experiment is performed on a high-speed railway experimental platform. The experimental results show that the proposed method is effective to assess the condition of the rail fastening system. The monitoring system significantly reduces the inspection time and increases the efficiency of maintenance management.

The machine vision measurement module is indispensable for the Modularized Flexible Precision Assembly Station (MFPAS), which is a fully automatic assembly system being developed at Dalian University of Technology (DUT). MFPAS consists of basic and additional modules, and are expected to be flexible, expandable, and re-configurable to adapt to a variety of parts with a large size range, requiring the machine vision measurement module to be able to achieve accurate measurement of position, as well as orientation of the parts with different size scale. An automatic zooming vision system was set up for evaluation and final integration in MFPAS. Pixel equivalent, principal point and orientation deviation of images were analyzed and experimentally studied using different magnifications of the lens. A new template with circular patterns of different diameters was designed for zoom-lens calibration. The experiments show that the measurement error caused by the variation of the pixel equivalent, principal point and orientation is estimated under 10 μm without online calibration. When high accuracy is required, online calibration can be employed during assembly. The evaluation results of the vision system with or without on-line calibration were given for a better trade-off between accuracy and efficiency during assembly.

The tiny magnetic steel pair (TMSP), composed by two tiny magnetic steel blocks (TMSBs), is critical for some precision instruments. Incorrect matching of TMSP may result in insufficient instrument performance. Herein, the matching method of TMSP based on the Kuhn–Munkres algorithm is proposed. Further, an automatic TMSP matching device is developed. Especially, an ingenious clamp for multiple constraints of TMSB is presented and a visual/magnetism/force hybrid control strategy is realized for the safe and efficient manipulation of TMSBs in a magnetic environment. Moreover, with the TMSBs of a pendulum accelerometer, the matching experiments are conducted to validate the comprehensive performance. The result of the numerical experiment shows that the Kuhn–Munkres algorithm-based method is stable and efficient. The results of measurement and TMSP matching experiments show that the device has good repeatability (<1 mT) and practicability. The proposed matching method has great application prospect in various matching and microassembly of TMSPs.

Piezoelectric transducer wafers are usually used in pairs to adjust the resonant cavity length of the ring laser gyro. In practice, the paired wafers are required to have similar piezoelectric charge coefficient d₃₁. To handle the pairing operation in-batch, an automatic sorting system was developed on the basis of deformation measurement, which adopted a frame of a Cartesian-coordinate robot. The wafers were self-aligned in the vertical direction, and a vacuum holder was used to pick up, transfer, and then place them on thee testing desk one by one. The excitation voltage was loaded on the wafer by a specifically designed electrode, and the resulting micro deformation was measured by dual opposite inductive micrometers using the relative measurement principle. This particular electrode has the function of attitude self-adjustment and vacuum adsorption, which is conducive to loading the voltage reliably and protecting the wafer from undesired damage. Finally, the wafers were transported to different stock bins based on the measuring results. This system is suited to handle a mass of wafers by continuous processing on site for its high reliability and measurement consistency. The measurement accuracy, validated by laser interferometry, was better than 0.5 μm and the repeatability was superior to 0.1 μm.