The solidification microstructure evolution of Ni-25 at.% Cu alloys under different undercooling degrees were studied by the cladding method and cyclic superheating method. Two grain refinement phenomena were observed in the obtained undercooling. In the low undercooling condition, dendrite remelting is the main reason for grain refinement in the recalescence process, while in the high undercooling condition, the stress accumulated in the recalescence process leads to recrystallization in the later stage of recalescence. Under the condition of high undercooling, the solidification structure is composed of complete equiaxed grains with relatively uniform grain size, which indicates that grain boundary migration occurs during grain growth.

Applying the composite technology of molten glass coating and superheating method, the molten Cu₆₀Ni₄₀ alloy has obtained different undercooling degrees. The microstructure of the alloy during rapid solidification was observed by metallographic microscope, and the evolution process of microstructure morphology was systematically studied. It is found that two significantly different grain refinement phenomena occur in the range of low undercooling and high undercooling. The characteristics of high proportion of large angle grain boundaries, random grain orientation and a large quantity of twin boundaries show that the grain refinement structure under high undercooling is due to recrystallisation. And the microhardness test results show that the average hardness of the grain refinement structure under large undercooling suddenly decreases sharply at the critical undercooling, which also confirms the recrystallisation mechanism of the refined grain under high undercooling.

The maximum undercooling that has been achieved for Ni-Cu alloy, by using molten glass purification and cyclic super-heating technology, is 270 K. With the help of high-speed photography, the solidification front images of Ni-Cu alloy at various typical undercooling were obtained. Two grain refinements occurred in the range of 60 K< ΔT < 100 K and ΔT > 170 K, the solidification front became smoother, and the solidification position appeared randomly. With the increase of undercooling, the transition from solute diffusion to thermal diffusion leads to the transition from coarse dendrite to directional fine dendrite. At large undercooling, considerable stress is accumulated and some dislocations exist in the microstructure. However, the proportion of high-angle grain boundaries is as high as 89%, with twin boundaries of 13.6% and most strain-free structures, and the microhardness decreases sharply. This indicates that the accumulated stress at large undercooling causes the plastic strains in the microstructure, and in the later stage of recalescence, part of the plastic strains is dissipated by the system and acts as the driving force to promote the recrystallization of the microstructure.

This study investigates the 3RPUR (3-Revolute–Prismatic–Universal–Revolute) variable parallel mechanism, employing screw theory and linear geometry to analyze the geometric relationships and constraint characteristics of the RPUR (Revolute–Prismatic–Universal–Revolute) limb kinematic pairs. The findings reveal that the constraint moment in the always remains perpendicular to the two axes of the U pair, forming an equivalent plane. Through the locking/unlocking mechanism of universal joints (U pair), the mechanism achieves dynamic degree-of-freedom reconstruction, enabling seamless switching between three translational (3T) and three translational-one-rotation (3T1R) motion modes. The continuity between motion and degrees of freedom during the variable cell process is demonstrated. This research reveals a strict 1:1 linear coupling between the rotational angle of the moving platform around the Z-axis and the U pair’s rotation angle under 3T1R mode. Simulation experiments validate the feasibility and coupling characteristics of both motion modes, providing theoretical and technical support for this mechanism’s adaptation to complex working conditions in mobile robotics applications, particularly where reconfigurable parallel mechanisms are required for multi-task flexibility.