Reverse engineering (RE) of electronic systems is performed for many different reasons, including, but not limited to, failure analysis and fault isolation, obsolescence management, proof of IP rights infringement, security assessment, development of attacks, and counterfeiting. Regardless of the goal, it is imperative that the community understands the requirements, complexities, and limitations of RE. Traditional RE is based on a destructive process of serial sectioning followed by imaging, which is time-consuming, expensive, and error-prone. However, with the advent of advanced characterization tools and imaging software, this is starting to change. In this paper, we introduce a nondestructive approach for printed circuit board (PCB) RE based on X-ray tomography. The imaging parameters for a successful tomography are explained in detail and combined with advanced 3-D image processing and analysis to automate RE, thereby lowering the associated time and cost. We demonstrate our proposed process on two PCBs, a four-layer custom designed board, and a more complex commercial board. Lessons learned from this effort can be used to both develop advanced countermeasures and establish a more efficient workflow for instances where RE is unavoidable.

Understanding human behavior and monitoring mental health are essential to maintaining the community and society's safety. As there has been an increase in mental health problems during the COVID-19 pandemic due to uncontrolled mental health, early detection of mental issues is crucial. Nowa-days, the usage of Intelligent Virtual Personal Assistants (IVA) has increased worldwide. Individuals use their voices to control these devices to fulfill requests and acquire different services. This paper proposes a novel deep learning model based on the gated recurrent neural network and convolution neural network to understand human emotion from speech to improve their IVA services and monitor their mental health.

Printed circuit board (PCB) assurance in the optical domain is a crucial field of study. Though there are many existing PCB assurance methods using image processing, computer vision (CV), and machine learning (ML), the PCB field is complex and increasingly evolving, so new techniques are required to overcome the emerging problems. Existing ML-based methods outperform traditional CV methods; however, they often require more data, have low explainability, and can be difficult to adapt when a new technology arises. To overcome these challenges, CV methods can be used in tandem with ML methods. In particular, human-interpretable CV algorithms such as those that extract color, shape, and texture features increase PCB assurance explainability. This allows for incorporation of prior knowledge, which effectively reduces the number of trainable ML parameters and, thus, the amount of data needed to achieve high accuracy when training or retraining an ML model. Hence, this study explores the benefits and limitations of a variety of common computer vision-based features for the task of PCB component detection. The study results indicate that color features demonstrate promising performance for PCB component detection. The purpose of this paper is to facilitate collaboration between the hardware assurance, computer vision, and machine learning communities.

Counterfeiting is an increasing concern for businesses and governments as greater numbers of counterfeit integrated circuits (IC) infiltrate the global market. There is an ongoing effort in experimental and national labs inside the United States to detect and prevent such counterfeits in the most efficient time period. However, there is still a missing piece to automatically detect and properly keep record of detected counterfeit ICs. Here, we introduce a web application database that allows users to share previous examples of counterfeits through an online database and to obtain statistics regarding the prevalence of known defects. We also investigate automated techniques based on image processing and machine learning to detect different physical defects and to determine whether or not an IC is counterfeit.

In this paper, we present the need for specialized artificial intelligence (AI) for counterfeit and defect detection of PCB components. Popular computer vision object detection techniques are not sufficient for such dense, low inter-class/high intra-class variation, and limited-data hardware assurance scenarios in which accuracy is paramount. Hence, we explored the limitations of existing object detection methodologies, such as region based convolutional neural networks (RCNNs) and single shot detectors (SSDs), and compared them with our proposed method, the electronic component localization and detection network (ECLAD-Net). The results indicate that, of the compared methods, ECLAD-Net demonstrated the highest performance, with a precision of 87.2% and a recall of 98.9%. Though ECLAD-Net demonstrated decent performance, there is still much progress and collaboration needed from the hardware assurance, computer vision, and deep learning communities for automated, accurate, and scalable PCB assurance.