Acetylation of wood imparts moisture durability, decay resistance, and dimensional stability to wood; however, making durable adhesive bonds with acetylated wood can be more difficult than with unmodified wood. The usual explanation is that the acetylated surface has fewer hydroxyl groups, resulting in a harder-to-wet surface and in fewer hydrogen bonds between wood and adhesive. This concept was evaluated using four different adhesives (resorcinol–formaldehyde, emulsion polymer isocyanate, epoxy, and melamine–formaldehyde) with unmodified wood, acetylated wood, and acetylated wood that had been planed. Strikingly, acetylation did not hinder adhesive bonds with a waterborne resorcinol–formaldehyde adhesive that bonded equally well to both unmodified and acetylated yellow poplar. An epoxy adhesive bonded better to the acetylated wood than to the unmodified wood, in contrast to an emulsion polymer isocyanate, which gave less durable bonds to acetylated than to unmodified wood. Planing of the acetylated wood surface prior to bonding reduced bond durability for the epoxy adhesive and increased the amount of surface hydroxyl groups, as measured using X-ray photoelectron spectroscopic analysis of the trifluoroacetic anhydride-treated wood. These experiments showed that wood modification is useful in understanding wood-adhesive interactions, in addition to determining how to develop adhesives for acetylated woods.

Determining adhesive bond performance for chemically modified wood is important not only for its commercial utility but also for understanding wood bond durability. Bulking modifications occupy space inside the cell wall, limiting the space available for water. We used two bulking modifications on yellow poplar (Liriodendron tulipifera L.): acetylation (Ac), which bulks and converts a wood hydroxyl group to an ester, while butylene oxide (BO) also bulks the wood but preserves a hydroxyl group. Both result in lower water uptake; however, the loss of the hydroxyl group with Ac reduces the wood’s ability to form hydrogen and other polar bonds with the adhesives. On the other hand, the BO reaction replaces a hydroxyl group with another one along a hydrocarbon chain; thus, this product may not be harder to bond than the unmodified wood. We investigated how these chemical modifications of wood affect bond performance with four adhesives: resorcinol-formaldehyde (RF), melamine-formaldehyde (MF), emulsion polymer isocyanate (EPI), and epoxy. The ASTM D 905 bond shear strength for both dry and wet samples showed that the BO results were quite similar to the unmodified wood, but the MF and EPI performed poorly on Ac-modified wood, in contrast to the results with RF and epoxy.

The flexural properties of wood–plastic composite (WPC) deck boards exposed to 9.5 years of environmental decay in Hilo, Hawaii, were compared to samples exposed to moisture and decay fungi for 12 weeks in the laboratory, to establish a correlation between sample flexural properties and calculated void volume. Specimens were tested for flexural strength and modulus, both wet and dry, at 23°C and 52°C. Some specimens degenerated to only 15% of original flexural strength. UV radiation had no impact on flexural properties of field-exposed boards; loss occurred mainly on the side opposite to the sun-exposed surface. The mechanism of the aging process on colonization of WPC by fungi was examined and is consistent with development of slow crack growth in the polyethylene matrix combined with wood decay by fungi. Wood particle decay, moisture, and elevated temperature were the major factors causing composite degradation, indicated by accumulation of voids and a severe decrease in flexural properties. To simulate long-term field impact (including decay) on WPC flexural properties in the laboratory, conditioning of specimens in hot water for an extended period of time is required. Exposure to water (70°C/5 days) was adequate for simulating long-term composite exposure in Hawaii of 4 × 15 × 86 mm³ specimens.

Reactive chemical modifications have been shown to impart decay resistance to wood. These modifications change hydroxyl availability, water uptake, surface energy, and the nanostructure of wood. Because fungal action occurs on the micro and nano scale, further investigation into the nanostructure may lead to better strategies to prevent fungal decay. The aim of this article is to introduce our findings using small angle neutron scattering (SANS) to probe the effects of chemical modifications on the nanostructure of wood fibers. Southern pine wood fiber samples were chemically modified to various weight percentage gains (WPG) using propylene oxide (PO), butylene oxide (BO), or acetic anhydride (AA). After modification, the samples were water leached for two weeks to remove any unreacted reagents, homopolymers or by-products and then the equilibrium moisture content (EMC) was determined. Laboratory soil-block-decay evaluations against the brown rot fungus Gloeophyllum trabeum were performed to determine weight loss and decay resistance of the modifications. To assist in understanding the mechanism behind fungal decay resistance, SANS was used to study samples that were fully immersed in deuterium oxide (D₂O). These measurements revealed that modifying the fibers led to differences in the swollen wood nanostructure compared to unmodified wood fibers. Moreover, the modifications led to differences in the nanoscale features observed in samples that were exposed to brown rot fungal attack compared to unmodified wood fibers and solid wood blocks modified with alkylene oxides.