Gallium oxide (Ga₂O₃) is emerging as a viable candidate for certain classes of power electronics, solar blind UV photodetectors, solar cells, and sensors with capabilities beyond existing technologies due to its large bandgap. It is usually reported that there are five different polymorphs of Ga₂O₃, namely, the monoclinic (β-Ga₂O₃), rhombohedral (α), defective spinel (γ), cubic (δ), or orthorhombic (ε) structures. Of these, the β-polymorph is the stable form under normal conditions and has been the most widely studied and utilized. Since melt growth techniques can be used to grow bulk crystals of β-GaO₃, the cost of producing larger area, uniform substrates is potentially lower compared to the vapor growth techniques used to manufacture bulk crystals of GaN and SiC. The performance of technologically important high voltage rectifiers and enhancement-mode Metal-Oxide Field Effect Transistors benefit from the larger critical electric field of β-Ga₂O₃ relative to either SiC or GaN. However, the absence of clear demonstrations of p-type doping in Ga₂O₃, which may be a fundamental issue resulting from the band structure, makes it very difficult to simultaneously achieve low turn-on voltages and ultra-high breakdown. The purpose of this review is to summarize recent advances in the growth, processing, and device performance of the most widely studied polymorph, β-Ga₂O₃. The role of defects and impurities on the transport and optical properties of bulk, epitaxial, and nanostructures material, the difficulty in p-type doping, and the development of processing techniques like etching, contact formation, dielectrics for gate formation, and passivation are discussed. Areas where continued development is needed to fully exploit the properties of Ga₂O₃ are identified.

The role of extended and point defects, and key impurities such as C, O, and H, on the electrical and optical properties of GaN is reviewed. Recent progress in the development of high reliability contacts, thermal processing, dry and wet etching techniques, implantation doping and isolation, and gate insulator technology is detailed. Finally, the performance of GaN-based electronic and photonic devices such as field effect transistors, UV detectors, laser diodes, and light-emitting diodes is covered, along with the influence of process-induced or grown-in defects and impurities on the device physics.

Recent advances in the theory and experimental realization of ferromagnetic semiconductors give hope that a new generation of microelectronic devices based on the spin degree of freedom of the electron can be developed. This review focuses primarily on promising candidate materials (such as GaN, GaP and ZnO) in which there is already a technology base and a fairly good understanding of the basic electrical and optical properties. The introduction of Mn into these and other materials under the right conditions is found to produce ferromagnetism near or above room temperature. There are a number of other potential dopant ions that could be employed (such as Fe, Ni, Co, Cr) as suggested by theory [see, for example, Sato and Katayama-Yoshida, Jpn. J. Appl. Phys., Part 2 39, L555 (2000)]. Growth of these ferromagnetic materials by thin film techniques, such as molecular beam epitaxy or pulsed laser deposition, provides excellent control of the dopant concentration and the ability to grow single-phase layers. The mechanism for the observed magnetic behavior is complex and appears to depend on a number of factors, including Mn–Mn spacing, and carrier density and type. For example, in a simple Ruderman–Kittel–Kasuya–Yosida carrier-mediated exchange mechanism, the free-carrier/Mn ion interaction can be either ferromagnetic or antiferromagnetic depending on the separation of the Mn ions. Potential applications for ferromagnetic semiconductors and oxides include electrically controlled magnetic sensors and actuators, high-density ultralow-power memory and logic, spin-polarized light emitters for optical encoding, advanced optical switches and modulators and devices with integrated magnetic, electronic and optical functionality.

Gallium oxide (Ga₂O₃) is emerging as a viable candidate for certain classes of power electronics with capabilities beyond existing technologies due to its large bandgap, controllable doping, and the availability of large diameter, relatively inexpensive substrates. These applications include power conditioning systems, including pulsed power for avionics and electric ships, solid-state drivers for heavy electric motors, and advanced power management and control electronics. Wide bandgap (WBG) power devices offer potential savings in both energy and cost. However, converters powered by WBG devices require innovation at all levels, entailing changes to system design, circuit architecture, qualification metrics, and even market models. The performance of high voltage rectifiers and enhancement-mode metal-oxide field effect transistors benefits from the larger critical electric field of β-Ga₂O₃ relative to either SiC or GaN. Reverse breakdown voltages of over 2 kV for β-Ga₂O₃ have been reported, either with or without edge termination and over 3 kV for a lateral field-plated Ga₂O₃ Schottky diode on sapphire. The metal-oxide-semiconductor field-effect transistors fabricated on Ga₂O₃ to date have predominantly been depletion (d-mode) devices, with a few demonstrations of enhancement (e-mode) operation. While these results are promising, what are the limitations of this technology and what needs to occur for it to play a role alongside the more mature SiC and GaN power device technologies? The low thermal conductivity might be mitigated by transferring devices to another substrate or thinning down the substrate and using a heatsink as well as top-side heat extraction. We give a perspective on the materials’ properties and physics of transport, thermal conduction, doping capabilities, and device design that summarizes the current limitations and future areas of development. A key requirement is continued interest from military electronics development agencies. The history of the power electronics device field has shown that new technologies appear roughly every 10-12 years, with a cycle of performance evolution and optimization. The older technologies, however, survive long into the marketplace, for various reasons. Ga₂O₃ may supplement SiC and GaN, but is not expected to replace them.

The sensitivity for detecting hydrogen with multiple ZnO nanorods is found to be greatly enhanced by sputter-depositing clusters of Pd on the surface. The resulting structures show a change in room- temperature resistance upon exposure to hydrogen concentrations in ${\mathrm{N}}_2$ of $10–500\mathrm{ppm}$ of approximately a factor of 5 larger than without Pd. Pd-coated ZnO nanorods detected hydrogen down to $<10\mathrm{ppm}$ , with relative responses of $>2.6\%$ at $10\mathrm{ppm}$ and $>4.2\%$ at $500\mathrm{ppm}$ ${\mathrm{H}}_2$ in ${\mathrm{N}}_2$ after a $10\min$ exposure. There was no response at room temperature to ${\mathrm{O}}_2$ . Approximately 95% of the initial ZnO conductance after exposure to hydrogen was recovered within $20\mathrm{s}$ by exposing the nanorods to either air or pure ${\mathrm{O}}_2$ . This rapid and easy recoverability make the Pd-coated nanorods suitable for practical applications in hydrogen-selective sensing at ppm levels at room temperature with $<0.4\mathrm{mW}$ power consumption.