We report the fabrication of quantum dot infrared photodetectors (QDIPs) on silicon (Si) substrates by means of metal wafer bonding and an epitaxial lift-off process. According to the photoluminescence (PL) and x-ray diffraction measurements, the QDIP layer was transferred onto the Si substrate without degradation of the crystal quality or residual strain. In addition, from the PL results, we found that an optical cavity was formed because Pt/Au of the bonding material was served as the back mirror and the facet of the GaAs/air was served as the front mirror. The device performance capabilities were directly compared and peak responsivity was enhanced by nearly twofold from 0.038 A/W to 0.067 A/W.
Faradaic electrochemical impedance spectroscopy (f-EIS) in the presence of redox reagent, e.g., [Fe(CN)6]3−/4−, is widely used in biosensors owing to its high sensitivity. However, in sensors detecting amyloid beta (Aβ), the redox reagent can cause the aggregation of Aβ, which is a disturbance factor in accurate detection. Here, we propose an interdigitated microelectrode (IME) based f-EIS technique that can alleviate the aggregation of Aβ and achieve high sensitivity by buffer control. The proposed method was verified by analyzing three different EIS-based sensors: non-faradaic EIS (nf-EIS), f-EIS, and the proposed f-EIS with buffer control. We analyzed the equivalent circuits of nf-EIS and f-EIS sensors. The dominant factors of sensitivity were analyzed, and the impedance change rates via Aβ reaction was compared. We measured the sensitivity of the IME sensors based on nf-EIS, f-EIS, and the proposed f-EIS. The results demonstrate that the proposed EIS-based IME sensor can detect Aβ with a sensitivity of 7.40-fold and 10.93-fold higher than the nf-EIS and the f-EIS sensors, respectively.
4 June 2013 in Semiconductor Science and Technology
In this study, we propose an eight-channel monolithic optical transmitter using silicon electro-absorption modulators (EAMs) based on free-carrier injection by Schottky junctions. The transmitter consists of a 1 × 8 silicon arrayed-waveguide grating (AWG) and eight 500-μm-long EAMs on a 5.41 × 2.84 mm2 footprint. It generates eight-channel dense wavelength-division multiplexing (DWDM) outputs with 1.33 nm channel spacing (Δλ) in the C-band from a single broadband light source and modulates each channel with over 3 dB modulation depth at 6 V peak-to-peak. The experimental results showed that the feasibility of a homogeneous silicon DWDM transmitter with a single light source for switch fabrics in intra-data-center interconnects over heterogeneous integration with regards to more complementary metal–oxide–semiconductor (CMOS) compatibility.
1 February 2013 in Journal of the Korean Physical Society