Electroplating processes are widely employed in industrial environments for a large variety of metallic coatings, ranging from technological to decorative applications. Even if the galvanic electrodeposition is certainly a mature technology, new concepts, novel applications, environmental legislation and the new material requirements for next-generation devices make the scientific research in this field still very active. This review focuses mostly at the decorative and wearable applications, and aims to create a bridge between the past knowledge and the future direction that this process, i.e., electrodeposition, is taking. Both the theoretical fundamentals as well as some of the most widespread practical applications—limited to metallic and alloy coatings—are explored. As an integral part of the industrial process, we take a look at the main techniques thought which the quality control of deposits and surfaces is carried out. Finally, global industrial performance and research directions towards sustainable solutions are highlighted.

The role of thiourea as an organic additive in the nucleation and growth mechanism was studied for copper deposition and its application in the decorative electroplating and fashion accessory industries. The bath was designed to reduce the environmental and ecological impacts using methanesulfonic acid as electrolyte as an alternative to alkaline cyanide baths. We evaluated the nucleation and growth mechanism of copper exploiting voltametric and chronoamperometric measurements with a brightener concentration ranging from 0 to 90 ppm. We used the Scharifker–Hills model to estimate the type of nucleation mechanism after progressive addition of thiourea. Scanning electron microscope was employed for surface analysis and morphological characterisation of the nuclei. We verified that progressive nucleation is a key step in the obtainment of a shiny and homogeneous copper film, but an excess of thiourea could cause parasitic adsorption reactions on the surface of the substrate. X-ray fluorescence spectroscopy was used for the thickness determination of the copper deposits and the electrodeposition efficiency correlated to thiourea concentration. Finally, the optimal concentration of thiourea was assessed to be 60 ppm for the used formulation of copper plating.

Noble metal coatings are commonly employed to improve corrosion resistance of metals in the electronic and jewellery industry. The corrosion resistance of electroplated goods is currently determinate with long, destructive and almost subjective interpretation corrosion tests in artificial atmosphere. In this study we present the application of electrochemical analysis to obtain fast and numerical information of the antiaging coating. We performed open circuit potential (OCP) and corrosion current measurement; we employed also the electrochemical impedance spectroscopy (EIS), commonly applied to organic or passivated metal with high-impedance, to find the best option for noble low-impedance coating analysis. For comparison, traditional standardized tests (damp heat ISO 17228, salt spray ISO 9227 and sulphur dioxide ISO 4524) were also performed.

Oxygen Reduction Reaction (ORR) catalysts, from waste automobile tyres obtained from Microwave assisted pyrolysis (MAP), were enriched with Co and Cu using the simple treatments sonochemical and electrochemical deposition. Catalytic activity was evaluated through onset potential and number of exchanged electrons measurements. Electrochemical data demonstrate an improvement in catalytic activity of the electrochemical modified char with Co. Char electrodes enriched with Co show a maximum positive shift of 40 mV with respect to raw char electrodes with a number of exchanged electrons per O₂ molecule close to 4 (as for Pt) for the best sample. This corresponds to a reduction of the production of unwanted oxygen peroxide from 23% for raw char to 1%. Sample structure evolution before and after electrochemical deposition and electro-catalysis was investigated by scanning transmission electron microscopy and XPS. Such electrochemical treatments open new possibilities of refining waste chars and finding an economic alternative to noble metals-based catalysts for alkaline fuel cells.

Lowering the platinum group metal content of oxygen reduction reaction catalysts is among the most prevalent research focuses in the field. This target is herein approached through supported Pd(II) complexes. Starting from a commercial macrocycle, a new ligand is synthesized, its solution behavior and binding properties briefly explored (potentiometry, UV-Vis) and then used to prepare a new catalyst. A supramolecular approach is used in order to obtain homogeneous decoration of carbon nanotubes surfaces, fostering novel possibilities to access single-ion active sites. The novel catalyst is characterized through X-ray photoelectron spectroscopy and scanning transmission electron microscopy and its promising oxygen reduction reaction performance is evaluated via rotating ring-disk electrode and rotating disk electrode in half-cell studies.

Bismuth thin films are a promising material for the technological development of new generation electronic devices. Bismuth results to be a topological insulator material with exceptional surface-state spin and valley properties suitable for spintronics, valleytronics, and quantum computing applications. In this study we present an application of Selective Electrodesorption Based Atomic Layer Deposition (SEBALD) for the synthesis of high crystallinity bismuth metal thin films through the alternating controlled deposition of selenium and bismuth on a monocrystalline silver (111) electrode. The following selective removal of selenium allows the formation of a high crystalline bismuth deposit. Now a Days bismuth ultra-thin films are obtained by vapor phase techniques or from aqueous solution containing organic additives. In most cases, these processes lead to a film with uncontrolled morphology and flat polycrystalline films. Here we explore the possibility to use the Electrochemical Atomic Layer Deposition (E-ALD) to deposit highly ordered ultrathin films from diluted aqueous solutions at room temperature and pressure.