A cost-effective, scalable and versatile method of preparing nano-ink without hazardous chemical precursors is a prerequisite for widespread adoption of printed electronics. Precursor-free synthesis by spark discharge is promising for this purpose. The synthesis of platinum nanoparticles (PtNPs) using a spark discharge under Ar, N2, and air has been investigated to prepare highly conductive nano-ink. The size, chemical composition, and mass production rate of PtNPs significantly depended on the carrier gas. Pure metallic PtNPs with sizes of 5.5 ± 1.8 and 7.1 ± 2.4 nm were formed under Ar and N2, respectively. PtNPs with sizes of 18.2 ± 9.0 nm produced using air consisted of amorphous oxide PtO and metallic Pt. The mass production rates of PtNPs were 53 ± 6, 366 ± 59, and 490 ± 36 mg/h using a spark discharge under Ar, N2, and air, respectively. It was found that the energy dissipated in the spark gap is not a significant parameter that determines the mass production rate. Stable Pt nano-ink (25 wt.%) was prepared only on the basis of PtNPs synthesized under air. Narrow (about 30 μm) and conductive Pt lines were formed by the aerosol jet printing with prepared nano-ink. The resistivity of the Pt lines sintered at 750 °C was (1.2 ± 0.1)·10−7 Ω·m, which is about 1.1 times higher than that of bulk Pt.
In this work, we studied the formation of conductive silver lines with high aspect ratios (AR = thickness/width) > 0.1 using the modernized method of aerosol jet printing on a heated silicon substrate. The geometric (AR) and electrical (resistivity) parameters of the formed lines were investigated depending on the number of printing layers (1–10 layers) and the temperature of the substrate (25–300 °C). The AR of the lines increased as the number of printing layers and the temperature of the substrate increased. An increase in the AR of the lines with increasing substrate temperature was associated with a decrease in the ink spreading as a result of an increase in the rate of evaporation of nano-ink. Moreover, with an increase in the substrate temperature of more than 200 °C, a significant increase in the porosity of the formed lines was observed, and as a result, the electrical resistivity of the lines increased significantly. Taking into account the revealed regularities, it was demonstrated that the formation of silver lines with a high AR > 0.1 and a low electrical resistivity of 2–3 μΩ∙cm is advisable to be carried out at a substrate temperature of about 100 °C. The adhesion strength of silver films formed on a heated silicon substrate is 2.8 ± 0.9 N/mm2, which further confirms the suitability of the investigated method of aerosol jet printing for electronic applications.
Printing nano-ink with platinum nanoparticles to generate conductive microstructures for electronics on different types of substrates has gained increasing interest in recent years. To solve the problem of the low conductivity of platinum (Pt) nano-ink, we synthesized chemically pure Pt nanoparticles with sizes of 18.2 ± 9.0 nm by spark discharge method. A low toxic solvent, ethylene glycol with water, was used to ensure the aggregation stability of Pt nanoparticles. Polyvinylpyrrolidone was used as an adhesive additive and binder in the nano-ink. Narrow and conductive Pt lines were generated by aerosol jet printing technology. The resistivity of the Pt lines sintered at 750 °C on alumina substrate was found to exceed the bulk Pt by about 13%. Moreover, the Pt film fabricated on polymer substrates has demonstrated excellent mechanical flexibility in terms of twisting tests.
The problem of the efficiency of energy transfer from a capacitive energy storage device to the region of nanoparticle synthesis in a spark discharge has been considered. Using the method for measuring pulsed voltages at short gas-discharge gaps developed by the authors, the time dependence of the voltage across the active resistance of the gaps was studied for copper and titanium electrodes in different discharge regimes. For the first time, stepwise changes were observed in the time dependence of the voltage at the moments of changing the current direction. The conclusion was made about the predominant release of electrical energy in the near-electrode regions of the discharge gap, where nanoparticle synthesis occurs. For a spark discharge, the voltage across the active resistance of the interelectrode gap weakly depends on the amplitude of the flowing current and, for metal electrodes, is of the order of several tens of volts. A formula is proposed for determining the energy transferred to the discharge gap. The efficiency of energy transfer to the discharge gaps increases with increasing the quality of the discharge circuit with the use of several series-connected interelectrode gaps (in our case, from 30 to 60%), with a decrease in the capacitance or initial voltage at the capacitor.
We have applied spark ablation technology for producing nanoparticles from platinum ingots (purity of 99.97 wt. %) as a feed material by using air as a carrier gas. A maximum production rate of about 400 mg/h was achieved with an energy per pulse of 0.5 J and a pulse repetition rate of 250 Hz. The synthesized nanomaterial, composed of an amorphous platinum oxide PtO (83 wt. %) and a crystalline metallic platinum (17 wt. %), was used for formulating functional colloidal ink. Annealing of the deposited ink at 750 °C resulted in the formation of a polycrystalline material comprising 99.7 wt. % of platinum. To demonstrate the possibility of application of the formulated ink in printed electronics, we have patterned conductive lines and microheaters on alumina substrates and 20 μm thick low-temperature co-fired ceramic (LTCC) membranes with the use of aerosol jet printing technology. The power consumption of microheaters fabricated on LTCC membranes was found to be about 140 mW at a temperature of the hot part of 500 °C, thus allowing one to consider these structures as promising micro-hotplates for metal oxide semiconductor (MOS) gas sensors. The catalytic activity of the synthesized nanoparticles was demonstrated by measuring the resistance transients of the non-sintered microheaters upon exposure to 2500 ppm of hydrogen.