This paper addresses the role of multilevel microstructures on the fatigue crack propagation behavior and the tensile properties of lath martensite with different substructure sizes. Microstructure characterization of the alloy was carried out by transmission electron microscopy (TEM), scanning electron microscopy (SEM), electron back-scattering diffraction (EBSD), and optical microscopy (OM). Based on the classic Hall–Petch relationship, the results of tensile tests showed that martensitic block is the effective control unit of yield strength. Furthermore, the plasticity of lath martensite is not sensitive to grain size. The tensile deformation mechanisms were also discussed. Fatigue crack propagation tests revealed that the coarse grain has a higher crack propagation threshold and lower crack propagation rate than the fine grain in lath martensitic steel. The change in the plasticity zone ahead of the crack tip leads to the transitional behavior of the fatigue crack propagation rate. When plasticity zone sizes are equal to the block size, the fatigue crack propagation reverts to a stable propagation stage. Finally, an empirical model was established to predict the fatigue crack propagation rate of the stable propagation stage based on the tensile properties of the lath martensitic steel.

In this study, solidified films of CaO-Al₂O₃-BaO-CaF₂-Li₂O-based mold fluxes with different contents of Al₂O₃ addition were acquired by immersing an improved water-cooled copper probe in bulk molten slags. This probe can obtain films with representative structures. Different slag temperatures and probe immersion times were employed to investigate the crystallization process. The crystals in the solidified films were identified using X-ray diffraction, the morphologies of the crystals were observed using optical microscopy and scanning electron microscopy, and the kinetic conditions, especially the activation energy of devitrified crystallization in glassy slags, were calculated and discussed based on the differential scanning calorimetry. The results indicated that after adding extra Al₂O₃, the growing speed and thickness of the solidified films increased, and more time was required for the film thickness to reach a steady state. In addition, fine spinel (MgAl₂O₄) precipitated in the films at the early stage of solidification after adding 10 wt% of extra Al₂O₃. Together with LiAlO₂, spinel (MgAl₂O₄) acted as nuclei for the precipitation of BaAl₂O₄. The apparent activation energy of initial devitrified crystallization decreased from 314.16 KJ/mol (original slag) to 297.32 KJ/mol (5 wt% Al₂O₃ added) and 269.46 KJ/mol (10 wt% Al₂O₃ added). The crystallization ratio of the films also increased after adding extra Al₂O₃.

M50NiL steel, which belongs to a new generation of case-hardening steels used in aerospace bearing applications, is used mainly for the manufacturing of aerospace transmission components that operate under high temperatures. In this study, the effects of the hot deformation parameters and the initial microstructure on the hot deformation behavior of M50NiL steel were investigated through Gleeble-3500 isothermal hot compression tests. The experimental results demonstrated that the critical stain of dynamic recrystallization and the deformation activation energy of the coarse-grained samples were higher than those of the fine-grained samples. This is attributed to the difficulty of deformation and the dynamic recrystallization behavior of coarse-grained samples. Moreover, fine-grained samples contain a large number of dispersed phases, which can pin the grain boundaries and inhibit the growth of recrystallized grains. Such phenomena are beneficial for obtaining finer and more uniform microstructures in M50NiL steel. The experimental results can provide a useful reference for preparing M50NiL steel with excellent mechanical properties.

An effective approach composed of solution treatment, multipass cold rolling and aging was developed to improve the strength and ductility of novel Al-Cu-Mn alloys. This approach increased the yield strength by 214 MPa over that of the conventional peak-aged samples while maintaining a good elongation of 8.7%. The microstructure evolution was examined by confocal laser scanning microscopy (CLSM), transmission electron microscopy (TEM) and X-ray diffraction (XRD). During postaging, deformed structures underwent a considerable decrease in dislocation density and typical dislocation network structures were formed. At the same time, highly dispersed nanoprecipitates and extensive ultrafine grains and nanograins were generated. These nanoprecipitations enabled effective dislocation pinning and accumulation during tension deformation. Therefore, composite nanostructures containing ultrafine grains, nanograins, dislocation network structures and nanoprecipitates were responsible for the simultaneous increases in strength and ductility. This paper provides a new understanding of designing composite nanostructure materials for achieving high strength and good ductility that is expected to be used for other age-hardenable alloys and steels.

In this study, novel slags with a high basicity index were used to refine silicon melts with carbon dioxide injection to effectively remove Ti from metallurgical-grade silicon. Different compositions of the initial slag were used, and silicon samples were obtained during the refining. The results indicate that the Ti-removal rate initially increased with an increase in the basicity index, and it decreased after the basicity index exceeded 1.4. During the refining, silicon emulsification was observed at the slag–silicon interface, which was restricted by the increased basicity index of slags. Impurities that were concentrated in silicon droplets near the slag–silicon interfaces were oxidized, wetted by slags, and transferred to the slag phase. After 15 min of refining, up to 59 wt% of Ti in silicon could be removed and the Ti-concentrating phase in the slag contained 2.05 wt% of Ti. The results of this study provide a reference for low-cost Ti removal from metallurgical-grade silicon using a refining method.