Some results are provided confirming that modifying of the zinc films fabricated on glass substrates by a resulting effect of heat treatment in an atmosphere of dry air and action of cross electric field is possible. Using scanning electron microscopy (measured with the Zeiss Merlin microscope) the surface morphology of the films was studied. Also, the elemental composition of the films by micro-X-ray spectral analysis was studied. On the glass substrates, by the method of vacuum thermal evaporation, zinc films (Zn) with thickness of ~ 500 nm were obtained. In order to form ZnO films, the original films were treated at 250 °C in a dry air atmosphere, and in another case - in addition to the sample a transverse electric field with a potential of 300 V was applied. Platinum films on the silicon dioxide layer were obtained using the method of the ion-plasma sputtering. These layers were investigated by X-ray phase analysis, electron and atomic force microscopy. The thickness of platinum layers was 50 and 100 nm. During the deposition (deposition temperature – 300 °C, deposition rate - 5 nm / min), applied voltage between the platinum film and the silicon plate was 5 V. The films, obtained by applying a biasing, showed a more homogeneous fine-grained structure and a higher rate of growth than the original samples. In this way ZnO films can be manufactured with the extended surface. The possibility of significant changes caused by electric field use in adhesion, structure and conductive properties of the coatings is discussed. The method of depositing platinum on a dielectric substrate with an additional electrostatic field is also substantiated. It is shown that the application of an electric voltage to the film leads to a significant change in the structure of the resulting coating.Forcitation:Pshchelko N.S., Vodkailo E.G., Tomaev V.V., Klimenkov B.D., Koshevoi V.L., Belorus A.O. Influence of electric field on adhesion and structure of conducting films on dielectric substances. Izv. Vyssh. Uchebn. Zaved. Khim. Khim. Tekhnol. 2017. V. 60. N 8. P. 100-104.

In this work the technique for improvement of thin metal films adhesion to dielectric substrates by means of electric field is considered. It is shown that that with temperature and voltage treatment the increase in adhesion of copper films can reach four times in comparison with initial sample. Similar results were observed for molybdenum films.

The process of ac electric conductivity in thin films of the poly[Cu(mSalpn-1,3)] complex compound has been studied for the first time. The experimental frequency dependence of the ac conductivity agrees with the model based on the hopping mechanism of charge transfer. The effect of temperature has been studied and the activation energies for charge carriers involved in the conductivity are determined. The role of the metal center (divalent copper) and the influence the electron structure of a ligand environment on the charge exchange in the metallopolymer structure are discussed.

Polymer samples of complexes of divalent copper with the H₂msalpn-1,3 ligand have been studied by optical spectroscopy. The optical density spectra of metal-polymer films have been analyzed taking into account the influence of preliminary thermal treatment. The spectral dependences of the absorption coefficient and optical band gap are determined for different experimental conditions.

This study aims to present the dielectric behavior of polymer complexes which is closely related to their molecular and electronic structures. Results show that when the poly-[CumSalpn-1.3] films are polarized by applying electric bias at low frequencies, the frequency dispersion of dielectric parameters and conductivity in an alternating electric field are clearly defined.