Thermoelectric devices offer a promising route for waste-heat recovery, yet conventional modules—consisting of multiple pairs of inorganic legs soldered to rigid metal electrodes—are intrinsically brittle and nearly impossible to repair or reconfigure once fabricated. Although recent incorporation of flexible or stretchable polymeric components has improved mechanical deformability, these integrated architectures cannot be modified for new functions or restored. In this study, we propose the concept of Lego-like thermoelectric leg blocks that enable on-demand repair and reconfiguration via modular assembly. Each block operates as an independent unit comprising PDMS-based, self-healing Ag-flake-embedded composite electrodes and 3D-printed BiSbTe and BiTeSe thermoelectric legs, yielding flexible, repairable, and modular devices. Assembled devices preserve performance under bending (radius ≈ 3.4 mm), stretching (40%), and even after cutting and reassembly. Moreover, repeated disassembly/reassembly into diverse geometries proceeds without measurable loss in power output. Our Lego-like blocks provide a versatile thermoelectric platform that combines flexibility, reparability, and reconfigurability.

The ongoing miniaturization of semiconductor devices necessitates continuous advancements in lithographic processes, which are critical for high-precision circuit formation. To prevent substrate damage during the etching step, a spin-on hardmask (SOH) layer is often introduced between the photoresist (PR) and the substrate. However, residual metal ions in SOH solutions can adversely affect integrated circuit performance, underscoring the need for efficient and chemically compatible removal strategies. This study investigates the adsorption of metal ions (Al³⁺, Cr³⁺, Cu²⁺, Fe³⁺, Ni²⁺, and Ti⁴⁺) from SOH solutions using mesoporous silica materials—MCM-41 and SBA-15—functionalized with various groups (–OH, –NH₂, –SH, and –CH₃). Adsorption performance was evaluated under solvent-only, monomer-containing, and polymer-containing conditions. Among the tested materials, amine-functionalized mesoporous silica exhibited the highest adsorption efficiency, with SBA-15-NH₂ showing relatively effective and uniform performance in polymer-containing systems. Isotherm analysis supported a monolayer chemical adsorption mechanism, suggesting the significance of surface functional groups in the adsorption process. These findings demonstrate the potential of functionalized mesoporous silica as a promising candidate for trace metal ion removal in semiconductor manufacturing, offering enhanced yield and improved process reliability.