A new dual-curing system based on sequential thiol–epoxy click polycondensation and epoxy anionic homopolymerization was studied. Formulations of diglycidyl ether of bisphenol A and trimethylolpropane tris(3-mercaptopropionate) with 1-methylimidazole as a base catalyst and excess of epoxy groups were prepared and characterized. The curing process is sequential: fast thiol–epoxy polycondensation takes place first, followed by slower homopolymerization of excess epoxy groups. This makes it possible to define curing sequences with easy time–temperature control for both curing stages. The network build-up process during the first curing stage can be easily modelled assuming ideal polycondensation, which allows tailoring the structure and properties of the intermediate materials. The homopolymerization of the excess epoxy groups in the second curing stage results in a higher glass transition temperature (T_g) in comparison with the stoichiometric thiol–epoxy material, thus extending the application of thiol–epoxy thermosets to wider temperature ranges.

In this work, epoxy-based shape-memory actuators have been developed by taking advantage of the sequential dual-curing of off-stoichiometric “thiol–epoxy” systems. Bent-shaped designs for flexural actuation were obtained thanks to the easy processing of these materials in the intermediate stage (after the first curing process), and successfully fixed through the second curing process. The samples were programmed into a flat temporary-shape and the recovery-process was analyzed in unconstrained, partially-constrained and fully-constrained conditions using a dynamic mechanical analyzer (DMA). Different “thiol–epoxy” systems and off-stoichiometric ratios were used to analyze the effect of the network structure on the actuation performance. The results evidenced the possibility to take advantage of the flexural recovery as a potential actuator, the operation of which can be modulated by changing the network structure and properties of the material. Under unconstrained-recovery conditions, faster and narrower recovery-processes (an average speed up to 80%/min) are attained by using materials with homogeneous network structure, while in partially- or fully-constrained conditions, a higher crosslinking density and the presence of crosslinks of higher functionality lead to a higher amount of energy released during the recovery-process, thus, increasing the work or the force released. Finally, an easy approach for the prediction of the work released by the shape-memory actuator has been proposed.

This paper presents a new methodology to develop “thiol-epoxy” shape-memory polymers (SMPs) with enhanced mechanical properties in a simple and efficient manner via “click” chemistry by using thermal latent initiators. The shape-memory response (SMR), defined by the mechanical capabilities of the SMP (high ultimate strength and strain), the shape-fixation and the recovery of the original shape (shape-recovery), was analyzed on thiol-epoxy systems by varying the network structure and programming temperature. The glass transition temperature (Tg) and crosslinking density were modified using 3- or 4- functional thiol curing agents and different amounts of a rigid triglycidyl isocyanurate compound. The relationship between the thermo-mechanical properties, network structure and the SMR was evidenced by means of qualitative and quantitative analysis. The influence of the programming temperature (Tprog) on the SMR was also analyzed in detail. The results demonstrate the possibility of tailoring SMPs with enhanced mechanical capabilities and excellent SMR, and intend to provide a better insight into the relationship between the network structure properties, programming temperature and the SMR of unconstrained (stress-free) systems; thus, making it easier to decide between different SMP and to define the operative parameters in the useful life.

An extensive characterization of a sequential dual-curing system based on off-stoichiometric “thiol-epoxy” mixtures was carried out using thiol compounds of different functionality. The intermediate and final materials obtained after each curing stages at different thiol-epoxy ratios were studied by means of thermomechanical and rheological experiments. The storage and loss modulus and the loss factor tan d were monitored during the curing process to analyse gelation and network structure build-up. The critical ratio for gelation was determined making use of the ideal Flory-Stockmayer theory and compared with experimental results. Intermediate materials obtained in the vicinity of the theoretical critical ratio did not have the mechanical consistency expected for partially crosslinked materials, did not retain their shape and even experienced undesired flow upon heating to activate the second curing reaction. The rheological results showed that the critical ratio is higher than the predicted value and that a softening during the second curing stage affects the shape-retention at this ratio. From the thermomechanical results, a wide range of intermediate and final materials with different properties and applicability can be obtained by properly choosing the thiol-epoxy ratio: from liquid-like to highly deformable intermediate materials and from moderately crosslinked (deformable) to highly crosslinked (brittle) final materials.Postprint (author's final draft

Our research group has recently found excellent shape-memory response in “thiol-epoxy” thermosets obtained with click-chemistry. In this study, we use their well-designed, homogeneous and tailorable network structures to investigate parameters for better control of the shape-recovery process. We present a new methodology to analyse the shape-recovery process, enabling easy and efficient comparison of shape-memory experiments on the programming conditions. Shape-memory experiments at different programming conditions have been carried out to that end. Additionally, the programming process has been extensively analysed in uniaxial tensile experiments at different shape-memory testing temperatures. The results showed that the shape-memory response for a specific operational design can be optimized by choosing the correct programming conditions and accurately designing the network structure. When programming at a high temperature (T ≫ T_g), under high network mobility conditions, high shape-recovery ratios and homogeneous shape-recovery processes are obtained for the network structure and the programmed strain level (ε_D). However, considerably lower stress and strain levels can be achieved. Meanwhile, when programming at temperatures lower than T_g, considerably higher stress and strain levels are attained but under low network mobility conditions. The shape-recovery process heavily depends on both the network structure and ε_D. Network relaxation occurs during the loading stage, resulting in a noticeable decrease in the shape-recovery rate as ε_D increases. Moreover, at a certain level of strain, permanent and non-recoverable deformations may occur, impeding the completion and modifying the whole path of the shape-recovery process.