The performance of Ag-8.5Au-3.5Pd alloy wire after cold deformation and annealing were analyzed by SEM (scanning electron microscope), strength tester and resistivity tester. The processing process and performance change characteristics of Ag-8.5Au-3.5Pd alloy wire were studied. The results show that alloy wire grains gradually form a fibrous structure along with the increase in deformation. The strength of the wire increases with the increase in deformation rate, but the increase trend becomes flat once the deformation rate is higher than 92.78%; the resistivity of Ag-8.5Au-3.5Pd alloy wire decreases with the increase in annealing temperature, reaching minimum (2.395 × 10⁻⁸ Ω·m) when the annealing temperature is 500 °C; the strength of Ag-8.5Au-3.5Pd alloy wire decreases with the increase in annealing temperature. When the annealing temperature is 500 °C, the strength and elongation of the φ0.2070 mm Ag-8.5Au-3.5Pd alloy wire are 287 MPa and 25.7%, respectively; the fracture force and elongation of φ0.020 mm Ag-8.5Au-3.5Pd alloy wire are 0.0876 N and 14.8%, respectively. When the annealing temperature is 550 °C, the metal grains begin to grow and the mechanical performance decrease; the φ0.020 mm Ag-8.5Au-3.5Pd alloy wire have good surface quality when the tension range is 2.5–3.0 g.

The effects of the geometry parameters of a ceramic cleaver on the morphology of ball and second bonded points were studied using an automatic wire bonder, push pull tester, scanning electron microscope, ceramic capillary with different geometric parameters and φ25.4 μmAg-5Au bonding alloy wire, etc. The result shows that when the inner hole diameter (IHD) of the ceramic capillary is 1.3 times the diameter of the alloy wire (33 μm), the neck morphology of the ball bonded point (first bonded point) meet the requirements. The neck of the ball bonded point appeared to fracture when the IHD is 26 μm; The neck of the ball bonded point appeared as an irregular shape when the IHD is 41 μm. When the inner cutting angle diameter (ICAD) is 64 μm, the size of the mashed ball diameter (MBD) is qualified. When the ICAD is 51 μm, the MBD is too large and mashed ball overflows the pad. When the ICAD is 76 μm, the ball bonded point is too high. When the inner cutting bevel angle (ICBA) is 100°, the MBD size meets the requirements of the pad. When the ICBA was reduced to 70°, the ball bonded point is eccentric. When the ICBA was increased to 120°, the MBD is too large and is connected to the adjacent pad contact. The size of the fish tail of the second bonded point (second bonded point) changed in the same direction as the tip diameter (TD) changes. When the TD is 178 μm, the fish tail shape is regular and symmetrical. When the working face angle (WFA) is 8° and the outer circular radius (OCR) is equal to the diameter of the alloy wire (25.4 μm), the fish tail shape is regular. When the WFA is higher than 11° or the OCR is higher than 30 μm, the fish tail will appear as virtual welding, and when the WFA is less than 4°, the fish tail of the second bonded point will break due to thinning. When the OCR is less than 20 μm, the fish tail of the second bonded point is too long and causes a short circuit.

This article conducts wire bonding tests and cold/hot-cycle tests using φ 0.025 mm Ag-Au alloy wires and Ag-Au-Pd alloy wires with different specifications. The results show that, due to the addition of the alloying element Pd, under the same bonding parameters, the fracture strength and ball-bonded point shear force of the Ag-Au-Pd alloy wires are significantly higher than those of the Ag-Au alloy wires. After the cold/hot-cycle tests, the failure probability of the Ag-Au-Pd alloy wires is approximately half that of the Ag-Au alloy wires. Among Ag-Au-Pd alloy wires, 92% break at the ideal positions, while 77% of the Ag-Au alloy wires break at the necks. As the Au content increases, the Free Air Ball (FAB) morphology of the Ag-Au-Pd alloy wires becomes more and more regular, gradually transitioning from a pointed ball to an ellipsoid and finally presenting a spherical shape.

The performance of rolling parameters and annealing processes on the microstructure and properties of Cu strip were studied by High Precision Rolling Mill, FIB, SEM, Strength Tester, and Resistivity Tester. The results show that with the increase of the reduction rate, coarse grains in the bonding Cu strip are gradually broken and refined, and the grains are flattened when the reduction rate is 80%. The tensile strength increased from 248.0 MPa to 425.5 MPa, while the elongation decreased from 8.50% to 0.91%. The growth of lattice defects and grain boundary density results in an approximately linear increase in resistivity. With the increase of annealing temperature to 400 °C, the Cu strip recovers, and the strength decreased from 456.66 MPa to 220.36 MPa while the elongation rose from 1.09% to 24.73%. The tensile strength and elongation decreased to 192.2 MPa and 20.68%, respectively, when the annealing temperature was 550 °C. The trend of yield strength of the Cu strip was basically the same as that of tensile strength. The resistivity of the Cu strip decreased rapidly during a 200~300 °C annealing temperature, then the trend slowed, and the minimum resistivity was 3.60 × 10⁻⁸ Ω·m. The optimum tension range annealing was 6–8 g; less or more than that will affect the quality of the Cu strip.