The flow behavior of an Al-Cu-Li-Mg-Ag alloy was studied by thermal simulation tests at deformation temperatures between 350 °C and 470 °C and strain rates between 0.01–10 s⁻¹. The microstructures of the deformed materials were characterized by electron backscattered diffraction. Constitutive equations were developed after considering compensation for strains. The processing maps were established and the optimum processing window was identified. The experimental data and predicted values of flow stresses were in a good agreement with each other. The influence of deformation temperature and strain rates on the microstructure were discussed. The relationship between the recrystallization mechanism and the Zener–Hollomon parameter was investigated as well.

The microstructure evolution of AA2060 Al alloy containing Li during two-stage homogenization treatment was investigated by optical microscopy (OM), scanning electron microscopy (SEM) equipped with energy dispersive X-ray spectroscopy (EDS), differential scanning calorimeter (DSC), transmission electron microscopy (TEM), mechanical properties and Vickers micro-hardness test methods. The results demonstrate that severe precipitation of θ(Al₂Cu) and S(Al₂CuMg) phase existed in the as-cast alloy, especially in the center position. Cu elements were concentrated at grain boundary and gradually decreased from the boundary to the interior. Numerous eutectic phases of θ(Al₂Cu) and S (Al₂CuMg) containing Zn and Ag elements were segregated at grain boundaries. The overheating temperature of the as-cast alloy is 497 °C. After two-stage homogenization treatment, the θ(Al₂Cu) and S (Al₂CuMg) in the surface, middle and center positions were completely dissolved into the matrix, thus achieved uniform homogenization effect. Moreover, water cooling could prevent the precipitation after homogenization, which provided good performance of the studied alloy. The optimum two-stage homogenization treatment of AA2060 alloy was 460 °C/4 h + 490 °C/2 4 h. The homogenization kinetic analysis was discussed as well.