Mixed metal oxide nanomaterials have been demonstrated to be promising positive electrodes for energy storage applications because of the synergistic enhancement effects. In this work, nickel-cobalt-molybdenum metal oxide (NCMO) nanosheets with hierarchical, porous structures were directly developed on nickel foam (NF) through a hydrothermal method and ensuing annealing treatment. Electrochemical tests in three-electrode configurations revealed that the as-prepared NCMO nanosheets possessed high specific capacitance (1366 F g⁻¹ at the current density of 2 A g⁻¹), good rate capability (71.3% at the current density of 40 A g⁻¹), as well as excellent cycling stability (89.75% retention after 5000 cycles). Additionally, a hybrid supercapacitor was assembled and achieved an energy density of 46.2 Wh kg⁻¹ at a power density of 713 W kg⁻¹. Based on the systematic analysis of microstructure, morphology, and element compositions, the excellent electrochemical performance of the NCMO nanosheets could be attributed to the mesoporous feature, desirable compositions, excellent mechanical and electrical contacts, and fast ion/electron transportation rates. This study shows that the NCMO nanosheets offer great potentials for application in supercapacitors.

Au/Si eutectic bonding is considered to BE a promising technology for creating 3D structures and hermetic packaging in micro-electro-mechanical system (MEMS) devices. However, it suffers from the problems of a non-uniform bonding interface and complex processes for the interconnection of metal wires. This paper presents a novel Au/Si eutectic wafer bonding structure and an implementation method for MEMS accelerometer packaging. The related processing parameters influencing the Au/Si eutectic bonding quality were widely investigated. It was found that a high temperature of 400 °C with a low heating/cooling rate of 5 °C/min is crucial for successful Au/Si eutectic bonding. High contact force is beneficial for bonding uniformity, but the bonding strength and bonding yield decrease when the contact force increases from 3000 to 5000 N due to the metal squeezing out of the interface. The application of TiW as an adhesion layer on a glass substrate, compared with a commonly used Cr or Ti layer, significantly improves the bonding quality. The bonding strength is higher than 50 MPa, and the bonding yield is above 90% for the presented Au/Si eutectic bonding. Furthermore, the wafer-level vacuum packaging of the MEMS accelerometer was achieved based on Au/Si eutectic bonding and anodic bonding with one process. Testing results show a nonlinearity of 0.91% and a sensitivity of 1.06 V/g for the MEMS accelerometer. This Au/Si eutectic bonding process can be applied to the development of reliable, low-temperature, low-cost fabrication and hermetic packaging for MEMS devices.

Manufacturing and integration of micro-electro-mechanical systems (MEMS) devices and integrated circuits (ICs) by wafer bonding often generate problems caused by thermal properties of materials. This paper presents a low temperature wafer direct bonding process assisted by O₂ plasma. Silicon wafers were treated with wet chemical cleaning and subsequently activated by O₂ plasma in the etch element of a sputtering system. Then, two wafers were brought into contact in the bonder followed by annealing in N₂ atmosphere for several hours. An infrared imaging system was used to detect bonding defects and a razor blade test was carried out to determine surface energy. The bonding yield reaches 90%–95% and the achieved surface energy is 1.76 J/m² when the bonded wafers are annealed at 350 °C in N₂ atmosphere for 2 h. Void formation was systematically observed and elimination methods were proposed. The size and density of voids greatly depend on the annealing temperature. Short O₂ plasma treatment for 60 s can alleviate void formation and enhance surface energy. A pulling test reveals that the bonding strength is more than 11.0 MPa. This low temperature wafer direct bonding process provides an efficient and reliable method for 3D integration, system on chip, and MEMS packaging.

Blazed gratings are the critical dispersion elements in spectral analysis instruments, whose performance depends on structural parameters and topography of the grating groove. In this paper, high diffraction efficiency silicon-blazed grating working at 800–2500 nm has been designed and fabricated. By diffraction theory analysis and simulation optimization based on the accurate boundary integral equation method, the blaze angle and grating constant are determined to be 8.8° and 4 μm, respectively. The diffraction efficiency is greater than 33.23% in the spectral range of 800–2500 nm and reach the maximum value of 85.62% at the blaze wavelength of 1180 nm. The effect of platform and fillet on diffraction efficiency is analyzed, and the formation rule and elimination method of the platform are studied. The blazed gratings are fabricated by anisotropic wet etching process using tilted (111) silicon substrate. The platform is minished by controlling etching time and oxidation sharpening process. The fillet radius of the fabricated grating is 50 nm, the blaze angle is 7.4°, and the surface roughness is 0.477 nm. Finally, the blazed grating is integrated in scanning micromirror to form scanning grating micromirror by MEMS fabrication technology, which can realize both optical splitting and scanning. The testing results show that the scanning grating micromirror has high diffraction efficiency in the spectral range of 810–2500 nm for the potential near-infrared spectrometer application.

Wafer direct bonding is an attractive approach to manufacture future micro-electro-mechanical system (MEMS) and microelectronic and optoelectronic devices. In this paper, a combined hydrophilic activated Si/Si wafer direct bonding process based on wet chemical activation and O₂ plasma activation is explored. Additionally, the effect on bonding interface characteristics is comprehensively investigated. The mechanism is proposed to better understand the nature of hydrophilic bonding. The water molecule management is controlled by O₂ plasma activation process. According to the contact angle measurement and FTIR spectrum analysis, it can be concluded that water molecules play an important role in the type and density of chemical bonds at the bonding interface, which influence both bonding strength and voids’ characteristics. When annealed at 350 °C, a high bonding strength of more than 18.58 MPa is obtained by tensile pulling test. Cross sectional SEM and TEM images show a defect-free and tightly bonded interface with an amorphous SiO_x layer of 3.58 nm. This amorphous SiO_x layer will induce an additional energy state, resulting in a lager resistance. These results can facilitate a better understanding of low-temperature hydrophilicity wafer direct bonding and provide possible guidance for achieving good performance of homogenous and heterogenous wafer direct bonding.

Developing rapid, efficient, highly sensitive, simple, stable, and low-cost virus marker detection products that are appropriate for basic facilities is of great importance in the early diagnosis and treatment of viruses. Naked-eye detection methods are especially important when medical testing facilities are limited. Polystyrene nanospheres (PSs) with catalytic and specific recognition functions were successfully developed by simultaneously modifying catalase and goat anti-hepatitis B surface antibodies on nanospheres. The modified PSs contributed significantly to the amplification of the signal. Via the specific antigen–antibody reaction, the bifunctional nanospheres could be captured on microplate and then catalyzed the decomposition of hydrogen peroxide to reduce chloroauric acid and synthesize gold nanoparticles (AuNPs). Due to the surface plasmon resonance of AuNPs, the solution color change could be observed with the naked eye and the limit of detection (LOD) was 0.1 ng/mL. Furthermore, the LOD observed with instrumentation was 0.01 ng/mL, which meant that a rapid, efficient, and highly sensitive method for the detection of hepatitis B surface antigens was successfully developed, and neither complex sample pretreatment nor expensive equipment was needed.