To achieve an effective surface-enhanced Raman scattering (SERS) sensor with periodically distributed “hot spots” on wafer-scale substrates, we propose a hybrid approach combining physical nano-imprint lithography and a chemical deposition method to form a silver microbead array. Nano-imprint lithography (NIL) can lead to mass-production and high throughput, but is not appropriate for generating strong “hot-spots.” However, when we apply electrochemical deposition to an NIL substrate and the reaction time was increased to 45 s, periodical “hot-spots” between the microbeads were generated on the substrates. It contributed to increasing the enhancement factor (EF) and lowering the detection limit of the substrates to 4.40 × 10⁶ and 1.0 × 10⁻¹¹ M, respectively. In addition, this synthetic method exhibited good substrate-to-substrate reproducibility (RSD < 9.4%). Our research suggests a new opportunity for expanding the SERS application.

Thermal interface materials (TIMs), typically composed of a polymer matrix with good wetting properties and thermally conductive fillers, are applied to the interfaces of mating components to reduce the interfacial thermal resistance. As a filler material, silver has been extensively studied because of its high intrinsic thermal conductivity. However, the high cost of silver and its toxicity has hindered the wide application of silver-based TIMs. Copper is an earth-abundant element and essential micronutrient for humans. In this paper, we present a copper-based multi-dimensional filler composed of three-dimensional microscale copper flakes, one-dimensional multi-walled carbon nanotubes (MWCNTs), and zero-dimensional copper nanoparticles (Cu NPs) to create a safe and low-cost TIM with a high thermal conductivity. Cu NPs synthesized by microwave irradiation of a precursor solution were bound to MWCNTs and mixed with copper flakes and polyimide matrix to obtain a TIM paste, which was stable even in a high-temperature environment. The cross-plane thermal conductivity of the copper-based TIM was 36 W/m/K. Owing to its high thermal conductivity and low cost, the copper-based TIM could be an industrially useful heat-dissipating material in the future.