Optical interconnects have been recognized as the most promising solution to accelerate data transmission in the artificial intelligence era. Benefiting from their cost-effectiveness, compact dimensions, and wavelength multiplexing capability, silicon microring resonator modulators emerge as a compelling and scalable means for optical modulation. However, the inherent trade-off between bandwidth and modulation efficiency hinders the device performance. Here we demonstrate a dense wavelength division multiplexing microring modulator array on a silicon chip with a full data rate of 1 Tb/s. By harnessing the two individual p-n junctions with an optimized Z-shape doping profile, the inherent trade-off of silicon depletion-mode modulators is greatly mitigated, allowing for higher-speed modulation with energy consumption of sub-ten fJ/bit. This state-of-the-art demonstration shows that all-silicon modulators can practically enable future 200 Gb/s/lane optical interconnects.

Heterogeneous III-V-on-silicon photonic integration has proved to be an attractive and volume manufacturable solution that marries the merits of III-V compounds and silicon technology for various photonic integrated circuit (PIC) applications. The current main-stream Ethernet trends for larger bandwidth are pushing higher modulation baudrate or employing advanced modulation format for datacom applications. However, neither solution is likely able to significantly drive overall solution cost and energy efficiency to the best sweet spot, nor to unfold the full potential of heterogeneous integration. Here we review our innovations on a special heterogeneous III-V-on-silicon platform, and the development of a dense wavelength division multiplexed (DWDM) transceiver. A 40-channel DWDM architecture and platform fabrication are discussed first, followed by experimental demonstration of each high-quality building block. InAs/GaAs quantum dot material is the choice for building robust multi-wavelength lasers, amplifiers, and high-speed avalanche photodetectors (APDs) which complements the more mature SiGe APDs. A metal-oxide-semiconductor capacitor phase shifter is a mission critical structure to provide athermal and efficient tuning for deinterleavers and microring resonators, and high-speed modulation. A successful 8 × 25 Gb/s link demonstration paves the way for the world's first fully-integrated DWDM PIC on Si with Terabit/s aggregated bandwidth and energy efficiency likely to ∼100 fJ/bit.

We demonstrate low-voltage waveguide silicon-germanium avalanche photodiodes (APDs) integrated with distributed Bragg reflectors (DBRs). The internal quantum efficiency is improved from 60% to 90% at 1550 nm assisted with DBRs while still achieving a 25 GHz bandwidth. A low breakdown voltage of 10 V and a gain bandwidth product of near 500 GHz are obtained. APDs with DBRs at a data rate of 64 Gb/s pulse amplitude modulation with four levels (PAM4) show a 30%–40% increase in optical modulation amplitude (OMA) compared to APDs with no DBR. A sensitivity of around − 13 dBm at a data rate of 64 Gb/s PAM4 and a bit error rate of 2.4 × 10 − 4 is realized for APDs with DBRs, which improves the sensitivity by ∼ 2 dB compared to APDs with no DBR.

InAlAs digital alloy avalanche photodiodes (APDs) exhibit lower excess noise than those fabricated from conventional random alloy material. Experiment and Monte Carlo simulation both show that relative to the random alloy the ionization probability for electrons is slightly lower while that of holes is greatly suppressed. We propose that the suppression of carrier ionization probability in digital alloys happens because of the creation of minibands that localize carriers. The difference of suppression between conduction bands and valence bands comes from the difference of scattering path.