In the past few decades, video endoscopy has become one of the primary medical devices in diverse clinical fields for examination, treatment, and early disease diagnosis of the gastrointestinal tract. For an accurate diagnosis, an endoscopic camera offering bright and wide field-of-view images is required while maintaining its compact dimensions to enter the long, narrow, and dark tract inside of the body. Recent endoscopic lenses successfully provide wide fields-of-view and have compact sizes for the system; however, their f-numbers still remain at 2.8 or higher. Therefore, further improvement in f-numbers is required to compensate for the restricted illumination system of the endoscopic probe. Here, we present a low f-number endoscopic lens design while providing wide field-of-view and high-resolution imaging. The proposed lens system achieved a low f-number of 2.2 and a field-of-view of 140 deg. The modulation transfer function (MTF) is over 20% at 180 lp/mm, and relative illumination is more than 60% in the full field. Additionally, the proposed lens is designed for a 1/4” 5-megapixel complementary metal-oxide-semiconductor (CMOS) image sensor with a pixel size of 1.4 µm. This all-plastic lens design could help develop a high-performance disposable endoscope that prevents the risk of infection or cross-contamination with mass manufacture and low cost.

This study presents a straightforward, efficient dual-mode thermoreflectance microscopy (TRM) system for analyzing the stationary and dynamic thermal properties of microelectronic devices. The proposed TRM system employs a standard visible microscope and implements two distinct imaging process schemes to obtain thermal images at different time scales. For TRM imaging of an ohmic microdevice, the optimal probing wavelength is predetermined from the thermoreflectance spectrum, acquired using a white light-emitting diode source and tunable bandpass filters to enhance thermal sensitivity. Thermoreflectance images are obtained in both stationary and transient modes using a four-bucket method and a pulsed boxcar averaging method, respectively. This thermography approach demonstrates highly sensitive, time-integrated stationary thermal imaging and time-gated transient thermal imaging with a temporal resolution of 200 ns. The system shows significant potential as an analytical tool with a sub-micron spatiotemporal resolution for evaluating heat generation and self-heating behavior in microelectronic devices.

High-resolution thermoreflectance microscopy is demonstrated for non-contact nanometer-scale thermal imaging. Optical fibers with sub-wavelength-sized apertures (ϕ = 50 nm) are adopted as optical scanning-probes to overcome the diffraction limit of conventional refractive optical microscopy. The spatial resolution down to 94.2 nm is achieved, clearly resolving thermal distributions of a gold resistive heater with 100-nm-wide lines and spaces. The demonstrated method will provide thermal imaging of advanced electronic devices along with uncompromised spatial resolution as well as high adaptability of wavelength tailored for material-specific thermoreflectance coefficients.