Millions of holes are produced in many industries where efficient drilling is considered the key factor in their success. High-quality holes are possible with the proper selection of drilling process parameters, appropriate tools, and machine setup. This paper deals with the effects of drilling parameters such as spindle speed and feed rate on the chips analysis and the hole quality like surface roughness, hole size, circularity, and burr formation. Al7075-T6 alloy, commonly used in the aerospace industry, was used for the drilling process, and the dry drilling experiments were performed using high-speed steel drill bits. Results have shown that surface roughness decreased with the increase in spindle speed and increased with the increase in the feed rate. The hole size increased with the high spindle speed, whereas the impact of spindle speed on circularity error was found insignificant. Furthermore, short and segmented chips were achieved at a high feed rate and low spindle speed. The percentage contribution of each input parameter on the output drilling parameters was evaluated using analysis of variance (ANOVA).

SAC305 lead-free solder alloy is widely used in the electronic industry. However, the problems associated with the growth formation of intermetallic compounds need further research, especially at high temperatures. This study investigates the doping of Bismuth into SAC305 in the various compositions of 1, 2, and 3 wt.%. The microstructure in terms of intermetallic compound particles and mechanical properties was examined after thermal aging at temperatures of 100 °C and 200 °C for 60 h. The microstructure examination was observed using scanning electron microscopy, and the chemical composition of each alloy was confirmed with an energy dispersive X-ray. Tensile tests were performed to find the mechanical properties such as yield strength and ultimate tensile strength. The intermetallic compound’s phase analysis was identified using X-ray diffraction, and differential scanning calorimetry was done to study the temperature curves for melting points. Results showed that the addition of Bismuth refined the microstructure by suppressing the growth of intermetallic compounds, which subsequently improved the mechanical properties. The thermal aging made the microstructure coarsen and degraded the mechanical properties. However, the most improved performance was observed with a Bismuth addition of 3 wt.% into SAC305. Furthermore, a decrease in the melting temperature was observed, especially at Bismuth compositions of 3 wt.%.

The incorporation and doping of elements represent a widely used approach to enhance the solidity, integrity, and characteristics of pb-free solder joints. The present study summarizes the incorporation of indium and its impact on the mechanical aspects of the SAC105 pb-free solder alloy. To refine the mechanical impact of the solder alloy, the evaluation of samples were categorized into three groups: as-cast, low-thermal aged (at 125 °C), and high-thermal aged (at 180 °C). The tensile deformation data were obtained via the universal tensile machine (UTM). Investigational findings demonstrated the enhancement in mechanical characteristics, including ultimate tensile and yield strength of the solder alloy. The addition of 1 wt.% of indium to SAC105 led to a notable increase in ultimate tensile strength, rising from 29.6 MPa to 35.31 MPa, which corresponds to an approximate 19.30% increase over the initial value.