The existing regular hexagonal cellular substrate for stretchable electronics minimizes the disruptions to the natural diffusive or convective flow of bio-fluids. Its anisotropy is insignificant, which is not ideal for mounting on skins that involve directional stretching. This paper proposes an irregular hexagonal cellular substrate with large anisotropy to minimize the constraints on the natural motion of the skin, and establishes an analytic model to study its stress–strain relation under finite stretching.

The fused filament fabrication (FFF) process deposits thermoplastic material in a layer-by-layer manner, expanding the design space and manufacturing capability compared with traditional manufacturing. However, the FFF process is inherently directional as the material is deposited in a layer-wise manner. Therefore, the in-plane material cannot reach the isotropy character when performing the tensile test. This would cause the strength of the print components to vary based on the different process planning selections (building orientation, toolpath pattern). The existing toolpaths, primarily used in the FFF process, are linear, zigzag, and contour toolpaths, which always accumulate long filaments and are unidirectional. Thus, this would create difficulties in improving the mechanical strength from the existing toolpath strategies due to the material in-plane anisotropy. In this paper, an in-plane isotropy toolpath pattern is generated to enhance the mechanical strength in the FFF process. The in-plane isotropy can be achieved through continuous deposition while maintaining randomized distribution within a layer. By analyzing the tensile strength on the specimens made by traditional in-plane anisotropy toolpath and the proposed in-plane isotropy toolpath, our results suggest that the mechanical strength can be reinforced by at least 20% using our proposed toolpath strategy in extrusion-based additive manufacturing.

Vibrational microplatforms that exploit complex three-dimensional (3D) architectures assembled via the controlled compressive buckling technique represent promising candidates in 3D micro-electromechanical systems (MEMS), with a wide range of applications such as oscillators, actuators, energy harvesters, etc. However, the accuracy and efficiency of such 3D MEMS might be significantly reduced by the viscoelastic damping effect that arises from material viscosity. Therefore, a clear understanding and characterization of such effects are essential to progress in this area. Here, we present a study on the viscoelastic damping effect in complex 3D structures via an analytical model and finite element analysis (FEA). By adopting the Kelvin–Voigt model to characterize the material viscoelasticity, an analytical solution is derived for the vibration of a buckled ribbon. This solution then yields a scaling law for the half-band width or the quality factor of vibration that can be extended to other classes of complex 3D structures, as validated by FEA. The scaling law reveals the dependence of the half-band width on the geometries of 3D structures and the compressive strain. The results could serve as guidelines to design novel 3D vibrational microplatforms for applications in MEMS and other areas of technology.

Three-dimensional coil structures assembled by mechanically guided compressive buckling have shown potential in enabling efficient thermal impedance matching of thermoelectric devices at a small characteristic scale, which increases the efficiency of power conversion, and has the potential to supply electric power to flexible bio-integrated devices. The unconventional heat dissipation behavior at the side surfaces of the thin-film coil, which serves as a “heat pump,” is strongly dependent on the geometry and the material of the encapsulating dissipation layer (e.g., polyimide). The low heat transfer coefficient of the encapsulation layer, which may damp the heat transfer for a conventional thermoelectric device, usually limits the heat transfer efficiency. However, the unconventional geometry of the coil can take advantage of the low heat transfer coefficient to increase its hot-to-cold temperature difference, and this requires further thermal analysis of the coil in order to improve its power conversion efficiency. Another challenge for the coil is that the active thin-film thermoelectric materials employed (e.g., heavily doped Silicon) are usually very brittle, with the fracture strain less than 0.1% in general while the overall device may undergo large deformation (e.g., stretched 100%). Mechanical analysis is therefore necessary to avoid failure/fracture of the thermoelectric material. In this work, we study the effect of coil geometry on both thermal and mechanical behaviors by using numerical and analytical approaches, and optimize the coil geometry to improve the device performance, and to guide its design for future applications.

The use of cellular elastomer substrates not only reduces its restriction on natural diffusion or convection of biofluids in the realm of stretchable electronics but also enhances the stretchability of the electronic systems. An analytical model of “zigzag” cellular substrates under finite deformation is established and validated in this paper. The deformed shape, nonlinear stress–strain curve, and Poisson’s ratio–strain curve of the cellular elastomer substrate calculated using the reported analytical model agree well with those from finite element analysis (FEA). Results show that lower restriction on the natural motion of human skin could be achieved by the proposed zigzag cellular substrates compared with the previously reported hexagonal cellular substrates, manifesting another leap toward mechanically “invisible” wearable, stretchable electronic systems.

Soft electrothermal actuators have attracted increasing attention in soft robotics and wearable systems due to their simple structure, low driving voltage, and ease of integration. However, traditional designs based on homogeneous or layered composites often suffer from interfacial failure and limited deformation modes, restricting their long-term stability and actuation versatility. In this study, we present a programmable soft electrothermal actuator based on a functionally graded structure composed of polydimethylsiloxane (PDMS)/multiwalled carbon nanotube (MWCNTs) composite material and an embedded EGaIn conductive circuit. Rheological and mechanical characterization confirms the enhancement of viscosity, modulus, and tensile strength with increasing MWCNTs content, confirming that the gradient structure improves mechanical performance. The device shows excellent actuation performance (bending angle up to 117°), fast response (8 s), and durability (100 cycles). The actuator achieves L-shaped, U-shaped, and V-shaped bending deformations through circuit pattern design, demonstrating precise programmability and reconfigurability. This work provides a new strategy for realizing programmable, multimodal deformation in soft systems and offers promising applications in adaptive robotics, smart devices, and human–machine interfaces.