Error compensation technology is used for improving accuracy and reducing costs. Dynamic error compensation techniques of coordinate measuring machine (CMM) are still under study; the major problem is a lack of suitable models, which would be able to correctly and simply relate the dynamic errors with the structural and operational parameters. To avoid the complexity of local dynamic deformation measurement and modeling, a comprehensive calibration method is employed. Experimental research reveals specific qualities of dynamic Abbe errors; the results exceed the scope of ISO 10360-2 calibration method, showing the ISO 10360-2 dynamic error evaluation deficiencies. For calibrating the dynamic Abbe errors, the differential measurement method is presented based on the measurements of the internal and external dimensions. Referring probe tip radius correction, the dynamic Abbe errors compensation method is proposed for CMM end-users and is easy to use.

This paper presents a method to improve the alignment accuracy of a mask in linear scale projection lithography, in which the adjacent pixel gray square variance method is applied to a charge-coupled device (CCD) image to obtain the best position of the focal length of the motherboard and then realize the alignment of the focal plane. Two image positions in the focal plane of the CCD are compared with the traits overlap according to the image splicing principle, and four typical errors are corrected on the basis of the total grating errors. Simultaneously, the rotation error of the mask is used to summarize the grayscale variation function of the CCD image. Threshold functions are employed to express the factors including the wave crests of the amplitude, period error, and phase error, which govern the rotation accuracy and weight alignment accuracy expression of the established four error factors. Finally, in the experiment, the slope of the mask is corrected and adjusted to the same direction as the slide plate with the assistance of a dual-frequency laser interferometer. The effect of the alignment error on the lithography accuracy is discussed and verified in the static case, and it is found that the CCD maximum resolution pixel is 0.1 μm and accuracy of the scale is 0.79 μm in only a 200-mm-measurement range.

This paper presents a method to improve the alignment accuracy of mask in linear scale projection lithography, in which the adjacent pixel gray square variance method of CCD image is used to find the best position of the focal length of the motherboard and then realize the alignment of the focal plane. Two image positions in the focal plane from the CCD are compared the traits overlap through the image splicing principle, and to establish the correction of four typical errors on the basis of the whole grating errors. At the same time, using the rotation error of the mask to summarize Grayscale Variation Function of CCD Image, and threshold functions are used to express the factors including wave crests of the amplitude, period error and phase error, which govern the rotation accuracy and weight alignment accuracy expression of the four error factors is established. In the experiment, it is finally corrected the slope of the mask and be adjusted the same direction of the slide plate with the help of dual-frequency laser interferometer, the influence of alignment error on lithography accuracy was discussed and verified in the static case and the CCD maximum resolution pixel corresponds to 0.1 μm, the accuracy of scale is 0.79 μm in only 200 mm measurement range.

A multi-repeated photolithography method for manufacturing an incremental linear scale using projection lithography is presented. The method is based on the average homogenization effect that periodically superposes the light intensity of different locations of pitches in the mask to make a consistent energy distribution at a specific wavelength, from which the accuracy of a linear scale can be improved precisely using the average pitch with different step distances. The method’s theoretical error is within 0.01 µm for a periodic mask with a 2-µm sine-wave error. The intensity error models in the focal plane include the rectangular grating error on the mask, static positioning error, and lithography lens focal plane alignment error, which affect pitch uniformity less than in the common linear scale projection lithography splicing process. It was analyzed and confirmed that increasing the repeat exposure number of a single stripe could improve accuracy, as could adjusting the exposure spacing to achieve a set proportion of black and white stripes. According to the experimental results, the effectiveness of the multi-repeated photolithography method is confirmed to easily realize a pitch accuracy of 43 nm in any 10 locations of 1 m, and the whole length accuracy of the linear scale is less than 1 µm/m.

The extraction simulation method and theory of cylindrical components were promoted in this paper. According to the manufacturing principle of the cylindrical components, the main influence factors of their precision manufacturing were analyzed, and their extraction models of cylindrical features were built under the analysis of the errors of the slideway and the spindle as well as the parallelism error between the slideway and the spindle rotary axis. The determination principle of modeling parameters of cylindrical features was studied. According to the extraction strategies of the roundness profiles, generatrix profiles, birdcage profile, and single spiral profile, some cylindrical features were simulated by using the established models, and their corresponding global sizes, calculated sizes, and form errors were evaluated and compared. The simulation experiments showed that the simulation models can meet the needs for the research of the relationship among the size tolerance, the form tolerance, the waviness, and the roughness, and can be taken as the theoretic base for the error budgets of the slideway and the rotation spindle in the design of precision machine tools.