Daosheng Wang

Mr. Daosheng Wang


Research Focus & Metrics

Academic Career Length

6Years (2021-Present)

(Calculated once Scilit publication data is synced: current year − year of first publication + 1)

Representative Publications

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17 August 2021 in Journal of Adhesion Science and Technology
Verified
Journal Article
Closed access
GLGuiyang Li
Guiyang Li
LYLiang Yin
Liang Yin
DWDaosheng Wang
Daosheng Wang
XXXuhai Xiong
Xuhai Xiong
PZPu Zhao
Pu Zhao
CTChaoyuan Tan
Chaoyuan Tan
The approach for joining carbon fiber reinforced epoxy (CF/Epoxy) composites proposed in this study is based on the use of a plasticizing chip (PC), one side with rich resin and the other side with bare fiber, prepared by 1, 2, 3 or 4 pieces of glass fiber reinforced polyetherimide (GF/PEI) prepregs and a piece of glass fiber cloth (GFC), added as a last ply in the stacking sequence of CF/Epoxy composites. During curing, the epoxy partially penetrates in the side with a bare fiber of PC, leading to micro-mechanical interlocking as the main connection mechanism between the PC and the CF/Epoxy composites. To verify the effects of PC on the thermal and mechanical properties of CF/Epoxy composites, TGA, DMA, DCB, bending, interlaminar shear and drop-weight tests were carried out. The results showed that PC can effectively alleviate the impact of thermal degradation without weakening the properties of CF/Epoxy composites.