Je-Young Chang

Dr. Je-Young Chang


Research Focus & Metrics

Academic Career Length

20Years (2007-Present)

(Calculated once Scilit publication data is synced: current year − year of first publication + 1)

Representative Publications

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23 September 2008 in Journal of Heat Transfer
Verified
Journal Article
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PDF file
JCJe-Young Chang
Je-Young Chang
RPRavi S. Prasher
Ravi S. Prasher
SPSuzana Prstic
Suzana Prstic
PCP. Cheng
P. Cheng
HMH. B. Ma
H. B. Ma

1 March 2019 in Journal of Electronic Packaging
Verified
Journal Article
Closed access
PDF file
AUAastha Uppal
Aastha Uppal
JPJerrod Peterson
Jerrod Peterson
JCJe-Young Chang
Je-Young Chang
XGXi Guo
Xi Guo
FLFrank Z. Liang
Frank Z. Liang
WTWeihua Tang
Weihua Tang
The demands for both thinner bare-die ball grid array (BGA) packages and thinner thermal solutions have added complexity for the thermal enabling design and material options associated with system on chip packages in mobile personal computer (PC) platforms. The thermomechanical interactions between the bare-die package and the thermal solution are very critical, creating the needs for: (1) an in-depth thermomechanical characterization to understand their impacts on product quality and performance and (2) a simple and yet robust modeling methodology to analyze design parameters using a commercially available software. In this paper, experimental metrologies and modeling methodology are developed with the details of contents documented. Validation of the newly developed tools and recommendation/guidance are also discussed for detailed assessments of thermomechanical tradeoffs for optimal design spaces for next-generation mobile platforms.

1 January 2007
Verified
Conference Paper
Closed access
PDF file
TTTao Tong
Tao Tong
JCJe-Young Chang
Je-Young Chang
SDShankar Devasenathipathy
Shankar Devasenathipathy
JDJohn Dirner
John Dirner
SPSuzana Prstic
Suzana Prstic
RPRavi Prasher
Ravi Prasher
Pumped-loop liquid-cooled system involving phase-change (two-phase) is a promising technology for removing excess heat from high-density electronics. However, no consensus has been reached so far regarding the hydraulic and heat transfer characteristics of such two-phase (TP) micro flow passages with hydraulic diameters (Dh) on the order of several hundred micrometers or smaller. In a previous paper [Tong et al., ASME IMECE2007-42027], we reported flow boiling experiments for several microchannel (MC) cold plate devices with channel widths ranging from 61 to 340 μm (hydraulic diameters from 100 to 337 μm) and a micro-pin-fin array (μPFA) device. Two working fluids, deionized water and HFE-7100, were tested respectively. In this paper, we focus on the highspeed visualization study of the phase-change phenomena inside the MC cold plates. Features of the major TP flow patterns are discussed for each MC unit with varying sizes and with the two different working fluids. From direct visualization, we report the liquid thin film evaporation rate for the pulsating annular flow regions in MCs. The observed liquid film evaporation rate is much higher than previous predictions/assumptions from a steady-state annular flow picture as assumed by most theoretical investigations so far. The local transient heat flux is thus much higher than the average heat flux provided, especially for water and small hydraulic diameter MCs.