Ai Wen Tan

Dr. Ai Wen Tan


Research Focus & Metrics

Academic Career Length

14Years (2013-Present)

(Calculated once Scilit publication data is synced: current year − year of first publication + 1)

Representative Publications

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17 August 2013 in Journal of Materials Science
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ATAi Wen Tan
Ai Wen Tan
BPBelinda Pingguan-Murphy
Belinda Pingguan-Murphy
RARoslina Ahmad
Roslina Ahmad
Sheikh AkbarSheikh Akbar
Sheikh Akbar

2 June 2016 in Metals
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SJShamini Janasekaran
Shamini Janasekaran
ATAi Wen Tan
Ai Wen Tan
FYFarazila Yusof
Farazila Yusof
MSMohd Hamdi Bin Abd Shukor
Mohd Hamdi Bin Abd Shukor
Double-sided laser beam welding of skin-stringer joints is an established method for many applications. However, in certain cases with limited accessibility, single-sided laser beam joining is considered. In the present study, single-sided welding of titanium alloy Ti6Al4V and nickel-based alloy Inconel 600 in a T-joint configuration was carried out using continuous-wave (CW), low-power Ytterbium (Yb)-fiber laser. The influence of the overlapping factor and welding speed of the laser beam on weld morphology and properties was investigated using scanning electron microscopy (SEM) and X-ray diffraction (XRD), respectively. XRD analysis revealed the presence of intermetallic layers containing NiTi and NiTi2 at the skin-stringer joint. The strength of the joints was evaluated using pull testing, while the hardness of the joints was analyzed using Vickers hardness measurement at the base metal (BM), fusion zone (FZ) and heat-affected zone (HAZ). The results showed that the highest force needed to break the samples apart was approximately 150 N at a laser welding power of 250 W, welding speed of 40 mm/s and overlapping factor of 50%. During low-power single-sided laser welding, the properties of the T-joints were affected by the overlapping factor and laser welding speed.

30 March 2016 in Materials
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Journal Article
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NJNur Ayuni Jamal
Nur Ayuni Jamal
ATAi Wen Tan
Ai Wen Tan
FYFarazila Yusof
Farazila Yusof
Katsuyohi KondohKatsuyohi Kondoh
Katsuyohi Kondoh
IHImai Hisashi
Imai Hisashi
HAHazleen Anuar
Hazleen Anuar
In recent years, closed-cell porous Aluminum (Al) has drawn increasing attention, particularly in the applications requiring reduced weight and energy absorption capability such as in the automotive and aerospace industries. In the present work, porous Al with closed-cell structure was successfully fabricated by powder metallurgy technique using PMMA as a space holder. The effects of the amount of PMMA powder on the porosity, density, microstructure and compressive behaviors of the porous specimens were systematically evaluated. The results showed that closed-cell porous Al having different porosities (12%–32%) and densities (1.6478 g/cm3, 1.5125 g/cm3 and 1.305 g/cm3) could be produced by varying the amount of PMMA (20–30 wt %). Meanwhile, the compressive behavior results demonstrated that the plateau stress decreased and the energy absorption capacity increased with increasing amount of PMMA. However, the maximum energy absorption capacity was achieved in the closed-cell porous Al with the addition of 25 wt % PMMA. Therefore, fabrication of closed-cell porous Al using 25 wt % PMMA is considered as the optimal condition in the present study since the resultant closed-cell porous Al possessed good combinations of porosity, density and plateau stress, as well as energy absorption capacity.

15 September 2016 in Metals
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Nashrah Hani JamadonNashrah Hani Jamadon
Nashrah Hani Jamadon
ATAi Wen Tan
Ai Wen Tan
FYFarazila Yusof
Farazila Yusof
TATadashi Ariga
Tadashi Ariga
YMYukio MIYASHITA
Yukio MIYASHITA
MSMohd Hamdi Bin Abd Shukor
Mohd Hamdi Bin Abd Shukor
The joining of lead-free Sn-3.0Ag-0.5Cu (SAC305) solder alloy to metal substrate with the addition of a porous Cu interlayer was investigated. Two types of porous Cu interlayers, namely 15 ppi—pore per inch (P15) and 25 ppi (P25) were sandwiched in between SAC305/Cu substrate. The soldering process was carried out at soldering time of 60, 180, and 300 s at three temperature levels of 267, 287, and 307 °C. The joint strength was evaluated by tensile testing. The highest strength for solder joints with addition of P25 and P15 porous Cu was 51 MPa (at 180 s and 307 °C) and 54 MPa (at 300 s and 307 °C ), respectively. The fractography of the solder joint was analyzed by optical microscope (OM) and scanning electron microscopy (SEM). The results showed that the propagation of fracture during tensile tests for solder with a porous Cu interlayer occurred in three regions: (i) SAC305/Cu interface; (ii) inside SAC305 solder alloy; and (iii) inside porous Cu. Energy dispersive X-ray spectroscopy (EDX) was used to identify intermetallic phases. Cu6Sn5 phase with scallop-liked morphology was observed at the interface of the SAC305/Cu substrate. In contrast, the scallop-liked intermetallic phase together with more uniform but a less defined scallop-liked phase was observed at the interface of porous Cu and solder alloy.