Current challenges in printed circuit board (PCB) assembly require high-resolution deposition of ultra-fine pitch components (<0.3 mm and <60 μm respectively), high throughput and compatibility with flexible substrates, which are poorly met by the conventional deposition techniques (e.g., stencil printing). Laser-Induced Forward Transfer (LIFT) constitutes an excellent alternative for assembly of electronic components: it is fully compatible with lead-free soldering materials and offers high-resolution printing of solder paste bumps (<60 μm) and throughput (up to 10,000 pads/s). In this work, the laser-process conditions which allow control over the transfer of solder paste bumps and arrays, with form factors in line with the features of fine pitch PCBs, are investigated. The study of solder paste as a function of donor/receiver gap confirmed that controllable printing of bumps containing many microparticles is feasible for a gap < 100 μm from a donor layer thickness set at 100 and 150 μm. The transfer of solder bumps with resolution < 100 μm and solder micropatterns on different substrates, including PCB and silver pads, have been achieved. Finally, the successful operation of a LED interconnected to a pin connector bonded to a laser-printed solder micro-pattern was demonstrated.

The laser induced forward transfer and sintering of metal nanoparticle inks has been proven a key enabling technology for flexible electronics. Nevertheless, many challenges concerning the conformal processing of non-planar substrates incorporating thermally sensitive layers are yet to be addressed. In this work, we study the behaviour of conformal laser printing of silver nanoparticle inks on patterned samples comprising sensitive underlying structures, by correlating the laser sintering powers employed to the undesired effects on the adjacent interfaces. The latter include demanding surface topographies with periodic patterns and micro-components exhibiting aspect ratio in the nano to 100-micron scale. We investigate the contribution of crucial processing parameters, such as the per pulse energy, repetition rate and the pulse to pulse spatial and temporal overlap to the overall result. The demonstrated results validate the versatility of laser processing which can offer application specific solutions on different use cases involving multilayered and multimaterial electronics.

Laser induced forward transfer (LIFT) and laser sintering of metal nanoparticle inks constitute a two-step digital fabrication technique which has been proven a key enabling technology for the fabrication of flexible microelectronic devices. In this work we will present the investigation of the laser printing and sintering process of Ag nanoparticle inks for the production of a conductive grid comprised of parallel lines as replacement for the bottom Indium Tin Oxide (ITO) electrode in organic photovoltaics (OPVs). We study the effect of a range of laser parameters and their impact on the morphological characteristics and the electrical performance of the laser printed conductive grid. The electrical conductivity of the laser printed lines is calculated by means of electrical measurements in a 4-point probe IV station while their morphological characteristics are assessed with profilometry measurements. As a result, flexible ITO-free OPVs incorporating laser-printed Ag grids as a bottom electrode on PET substrates will be presented. The results confirm that the laser printing and sintering combination is an advantageous technique, which can offer a distinguishing solution for applications in highly efficient ITO-free OPVs.