The resistive switching (RS) characteristics of flexible films deposited on mica substrates have rarely been reported upon, especially flexible HfO₂ films. A novel flexible Au/HfO₂/Pt/mica resistive random access memory device was prepared by a sol-gel process, and a Au/HfO₂/Pt/Ti/SiO₂/Si (100) device was also prepared for comparison. The HfO₂ thin films were grown into the monoclinic phase by the proper annealing process at 700 °C, demonstrated by grazing-incidence X-ray diffraction patterns. The ratio of high/low resistance (off/on) reached 1000 and 50 for the two devices, respectively, being relatively stable for the former but not for the latter. The great difference in ratios for the two devices may have been caused by different concentrations of the oxygen defect obtained by the X-ray photoelectron spectroscopy spectra indicating composition and chemical state of the HfO₂ thin films. The conduction mechanism was dominated by Ohm’s law in the low resistance state, while in high resistance state, Ohmic conduction, space charge limited conduction (SCLC), and trap-filled SCLC conducted together.

(Pb_0.97La_0.02)(Zr_0.95Ti_0.05)O₃ (PLZT2/95/5) ceramics were successfully prepared via a solid-state reaction route. The dielectric properties were investigated in the temperature region of 26–650 °C. The dielectric diffuse anomaly in the dielectric relaxation was found in the high temperature region of 600–650 °C with increasing the measuring frequency, which was related to the dynamic thermal process of ionized oxygen vacancies generated in the high temperature. Two phase transition points were detected during heating, which were found to coexist from 150 to 200 °C. Electric field induced ferroelectric to antiferroelectric phase transition behavior of the (Pb_0.97La_0.02)(Zr_0.95Ti_0.05)O₃ ceramics was investigated in this work with an emphasis on energy storage properties. A recoverable energy-storage density of 0.83 J/cm³ and efficiency of 70% was obtained in (Pb_0.97La_0.02)(Zr_0.95Ti_0.05)O₃ ceramics at 55 kV/cm. Based on these results, (Pb_0.97La_0.02)(Zr_0.95Ti_0.05)O₃ ceramics with a large recoverable energy-storage density could be a potential candidate for the applications in high energy-storage density ceramic capacitors.

Resistive random-access memory (RRAM) is a promising candidate for next-generation non-volatile memory. However, due to the random formation and rupture of conductive filaments, RRMS still has disadvantages, such as small storage windows and poor stability. Therefore, the performance of RRAM can be improved by optimizing the formation and rupture of conductive filaments. In this study, a hafnium oxide-/aluminum-doped zinc oxide/hafnium oxide (HfO₂/Al-ZnO/HfO₂) tri-layer structure device was prepared using the sol–gel method. The oxygen-rich vacancy Al-ZnO layer was inserted into the HfO₂ layers. The device had excellent RS properties, such as an excellent switch ratio of 10⁴, retention of 10⁴ s, and multi-level storage capability of six resistance states (one low-resistance state and five high-resistance states) and four resistance states (three low-resistance states and one high-resistance state) which were obtained by controlling stop voltage and compliance current, respectively. Mechanism analysis revealed that the device is dominated by ohmic conduction and space-charge-limited current (SCLC). We believe that the oxygen-rich vacancy concentration of the Al-ZnO insertion layer can improve the formation and rupture behaviors of conductive filaments, thereby enhancing the resistive switching (RS) performance of the device.

Herein, Bi₄Ti₃O₁₂ (BIT) ferroelectric thin films were fabricated into Au/BIT/LaNiO₃/Si structures to demonstrate their memristor properties. Repeatable and stable bipolar resistive switching (RS) characteristics of the device are first reported in this work. The switching ratio of the device annealed in air reached approximately 10² at 0.1 and −0.1 V. The RS performance was not significantly degraded after 100 consecutive cycles of testing. We also explored the factors affecting the RS behavior of the device. By investigating the RS characteristics of the devices annealed in O_2, and in combination with XPS analysis, we found that the RS properties were closely related to the presence of oxygen vacancies. The devices annealed in air exhibited a markedly improved RS effect over those annealed in O₂. According to the slope fitting, the conduction mechanism of the device was the ohmic conduction and space charge limited current (SCLC). This study is the first to successfully apply BIT ferroelectric films to the RS layers of memristors. Additionally, a theory of conductive filaments is proposed to adequately explain the relationship between RS behavior and oxygen vacancies, providing meaningful inspiration for designing high-quality resistive random access memory devices.

Negative charge card refrigeration, as a new solid-state refrigeration technology, has garnered much interest with its broad application potential in the area of temperature control for sensors and electronic devices. In this study, antiferroelectric thin films of Pb1−xMnxZrO3 (x = 0.0%, 0.5%, 1.0%, 2.0%, abbreviated as PMZ-100x) were prepared on tin oxide doped with fluorine/glass substrates by the sol-gel method. When the variable temperature P–E loops under various applied electric fields are compared, the P–E loops gradually change from linear to typical double P–E loops. This result implies that temperature and electric field work together to induce the phase change. The negative electrocaloric effect of the PMZ-0.5 film is greatly enhanced at 50 °C, 444 kV/cm, ΔS = 16.75 J·K−1·kg−1, ΔT = −16.39 K, in comparison to the PbZrO3 film (ΔS = 11.84 J·K−1·kg−1, ΔT = −12.48 K at 75 °C, 421 kV/cm). The great cooling performance indicates that PMZ-100x films have excellent potential for use in integrated circuit solid-state cooling.