Thermoelectric (TE) materials play a crucial role in converting energy between heat and electricity, essentially for environmentally friendly renewable energy conversion technologies aimed at addressing the global energy crisis. Significant advances in TE performance have been achieved over the past decades in various TE materials through key approaches, such as nanostructuring, band engineering, and high-entropy engineering. Among them, the design of high-entropy materials has recently emerged as a forefront strategy to achieve significantly low thermal conductivity, attributed to severe lattice distortion and microstructure effects, thereby enhancing the materials’ figure of merit (zT). This review reveals the progress of high-entropy TE materials developed in the past decade. It discusses high-entropy-driven structural stabilization to maintain favorable electrical transport properties, achieving low lattice thermal conductivity, and the impact of high entropy on mechanical properties. Furthermore, the review explores the theoretical development of high-entropy TE material and discusses potential strategies for future advancements in this field through interactions among experimental and theoretical studies.

Solidification cracking is a major obstacle when joining dissimilar alloys using additive manufacturing. In this work, location-specific solidification cracking susceptibility has been investigated using an integrated computational materials engineering (ICME) approach for a graded alloy formed by mixing P91 steel and Inconel 740H superalloy. An alloy mixture of 26 wt.% P91 and 74 wt.% Inconel 740H, with high configurational and total entropy, was fabricated using wire arc additive manufacturing. Microstructure characterization revealed intergranular solidification cracks in the FCC matrix, which increased in length along with the enrichment of Nb (~27 to 56 wt.%) and Cu (~87 wt.%) in the middle and top regions. DICTRA simulations to model location-specific solidification cracking susceptibility showed that the top region with the highest cooling rate (270 K/s) has the highest solidification cracking susceptibility in comparison with the middle and bottom regions. This is in good agreement with the experimentally observed varying crack length. From Scheil simulations, it was deduced that enrichment of Nb and Cu affected the solidification range as high as ~77%, in comparison with the matrix composition. The overall solidification cracking susceptibility and freezing range was highest for the 26 wt.% P91 alloy amongst the mixed compositions between P91 steel and 740H superalloy, proving that solidification characteristics play a major role in alloy design for additive manufacturing.

Wire-feed additive manufacturing (WFAM) produces superalloys with complex thermal cycles and unique microstructures, often requiring optimized heat treatments. To address this challenge, we present a hybrid approach that combines high-throughput experiments, precipitation simulation, and machine learning to design effective aging conditions for the WFAM Haynes 282 superalloy. Our results demonstrate that the γ’ radius is the critical microstructural feature for strengthening Haynes 282 during post-heat treatment compared with the matrix composition and γ’ volume fraction. New aging conditions at 770°C for 50 hours and 730°C for 200 hours were discovered based on the machine learning model and were applied to enhance yield strength, bringing it on par with the wrought counterpart. This approach has significant implications for future AM alloy production, enabling more efficient and effective heat treatment design to achieve desired properties.

Thermal interface material (TIM) that exists in a liquid state at the service temperature enables efficient heat transfer across two adjacent surfaces in electronic applications. In this work, the thermal conductivities of different phase regions in the Ga-In system at various compositions and temperatures are measured for the first time. A modified comparative cut bar technique is used for the measurement of the thermal conductivities of Ga_xIn_1−x (x = 0, 0.1, 0.214, 0.3, and 0.9) alloys at 40, 60, 80, and 100 °C, the temperatures commonly encountered in consumer electronics. The thermal conductivity of liquid and semi-liquid (liquid + β) Ga-In alloys are higher than most of the TIM’s currently used in consumer electronics. These measured quantities, along with the available experimental data from literature, served as input for the thermal conductivity parameter optimization using the CALPHAD (calculation of phase diagrams) method for pure elements, solution phase, and two-phase region. A set of self-consistent parameters for the description of the thermal conductivity of the Ga-In system is obtained. There is good agreement between the measured and calculated thermal conductivities for all of the phases. Due to their ease of manufacturing and high thermal conductivity, liquid/semi-liquid Ga-In alloys have significant potential for TIM in consumer electronics.

Inconel 740H superalloy is commonly used in advanced ultra-supercritical power plants since it possesses excellent strength and creep resistance. This study investigates the microstructure and mechanical properties of Inconel 740H superalloy fabricated using wire-arc additive manufacturing. The as-printed microstructure consisted of columnar γ grains with the Laves phase and (Nb, Ti)C carbides as secondary phases. The anisotropy in grain structure increased from the bottom to the top regions, while the hardness was highest in the middle portion of the build. To guide the post-heat treatment design, thermodynamic and kinetic simulations were employed to predict the temperature and time. Complete recrystallization with the Laves phase dissolution occurred throughout the build after homogenization at 1200 °C for 2 h. The peak hardness was achieved after aging at 760 °C for 12 h with the M₂₃C₆ carbides decorating the grain boundaries and γ’ precipitates in the grain interior. The yield strength (655 MPa) and ductility (29.5%) in the post-heat treated condition exceeded the design targets (620 MPa, 20%). Stress rupture tests at 750 °C showed that the high-temperature performance was at par with the wrought counterparts. The fracture mode after rupture was identified to be intergranular with the presence of grain boundary cavities along with grain boundary sliding.

Crack-free Stellite-6 alloy was fabricated using the laser powder bed fusion technique equipped with a heating module as the first attempt. Single tracks were printed with a build plate heated to 400 °C to identify the processing window. Based on the melt pool dimensions, two combinations (sample A: 300 W/750 mm/s and sample B: 275 W/1000 mm/s) were identified to print the cubes. The as-printed microstructure comprised FCC-Co dendrites with M₇C₃ in the interdendritic region. W-rich M₆C particles were found in the overlapping regions between the melt pools, matching the Scheil simulations. However, gas pores were observed due to the higher nitrogen and oxygen content of the feedstock requiring hot isostatic pressing (HIP) at 1250 °C and 150 MPa for 2 h. Sample A was partially recrystallized with slightly coarsened M₇C₃, while sample B underwent complete recrystallization followed by grain growth along with higher coarsening of the M₇C₃ after HIP. The varying recrystallization behavior can be attributed to the difference in residual stresses and grain aspect ratio in the as-built condition dictated by laser power and scanning speed. The microhardness after HIP was slightly higher than its wrought counterpart, indicating no severe impact of post-processing on the properties of Stellite-6 alloy.