Gong Chen

Mr. Gong Chen

orcid

Research Focus & Metrics

Academic Career Length

13Years (2014-Present)

(Calculated once Scilit publication data is synced: current year − year of first publication + 1)

Representative Publications

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1 January 2014 in Discrete and Continuous Dynamical Systems
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Journal Article
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GCGong Chen
Gong Chen
POPeter J. Olver
Peter J. Olver
When posed on a periodic domain in one space variable, linear dispersive evolution equations with integral polynomial dispersion relations exhibit strikingly different behaviors depending upon whether the time is rational or irrational relative to the length of the interval, thus producing the Talbot effect of dispersive quantization and fractalization. The goal here is to show that these remarkable phenomena extend to nonlinear dispersive evolution equations. We will present numerical simulations, based on operator splitting methods, of the nonlinear Schrödinger and Korteweg--deVries equations with step function initial data and periodic boundary conditions. For the integrable nonlinear Schrödinger equation, our observations have been rigorously confirmed in a recent paper of Erdoǧan and Tzirakis, [10].

12 July 2023 in Carbohydrate Polymers
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Journal Article
Closed access
JHJianhua Huang
Jianhua Huang
GCGong Chen
Gong Chen
THTianhang Han
Tianhang Han
CYChenxin Yi
Chenxin Yi
YZYujia Zhang
Yujia Zhang
SZShuai Zhou
Shuai Zhou

29 February 2024 in Applied Thermal Engineering
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Journal Article
Closed access
SZShiwei Zhang
Shiwei Zhang
HLHang Liu
Hang Liu
CSChangkun Shao
Changkun Shao
FYFan Yang
Fan Yang
ZWZhiwei Wang
Zhiwei Wang
GCGong Chen
Gong Chen

6 November 2023 in Applied Thermal Engineering
Verified
Journal Article
Closed access
XYXuepeng Yuan
Xuepeng Yuan
CYCaiman Yan
Caiman Yan
YHYunxian Huang
Yunxian Huang
YTYong Tang
Yong Tang
SZShiwei Zhang
Shiwei Zhang
GCGong Chen
Gong Chen

26 August 2025 in Energy Conversion and Management
Verified
Journal Article
Closed access
SZShiwei Zhang
Shiwei Zhang
XZXingyu Zheng
Xingyu Zheng
DCDaitian Chen
Daitian Chen
YHYao Huang
Yao Huang
WYWei Yuan
Wei Yuan
GCGong Chen
Gong Chen

18 August 2021 in Micromachines
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Journal Article
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KTKairui Tang
Kairui Tang
JBJingjing Bai
Jingjing Bai
SCSiyu Chen
Siyu Chen
SZShiwei Zhang
Shiwei Zhang
JLJie Li
Jie Li
GCGong Chen
Gong Chen
With the rapid development of electronics, thermal management has become one of the most crucial issues. Intense research has focused on surface modifications used to enhance heat transfer. In this study, multilayer copper micromeshes (MCMs) are developed for commercial compact electronic cooling. Boiling heat transfer performance, including critical heat flux (CHF), heat transfer coefficients (HTCs), and the onset of nucleate boiling (ONB), are investigated. The effect of micromesh layers on the boiling performance is studied, and the bubbling characteristics are analyzed. In the study, MCM-5 shows the highest critical heat flux (CHF) of 207.5 W/cm2 and an HTC of 16.5 W(cm2·K) because of its abundant micropores serving as nucleate sites, and outstanding capillary wicking capability. In addition, MCMs are compared with other surface structures in the literature and perform with high competitiveness and potential in commercial applications for high-power cooling.