This paper reviews the current state of power supply technology platforms and highlights future trends and challenges toward realizing fully monolithic power converters. This paper presents a detailed survey of relevant power converter technologies, namely power supply in package and power supply on chip (PwrSoC). The performance of different power converter solutions reported in the literature is benchmarked against existing commercial products. This paper presents a detailed review of integrated magnetics technologies, primarily microinductors, a key component in realizing a monolithic power converter. A detailed review and comparison of different microinductor structures and the magnetic materials used as inductor cores is presented. The deposition techniques for integrating the magnetic materials in the microinductor structures are discussed. This paper proposes the use of two performance metrics or figures of merit in order to compare the dc and ac performance of individual microinductor structures. Finally, the authors discuss future trends, key challenges, and potential solutions in the realization of the “holy grail” of monolithically integrated power supplies (PwrSoC).

This paper presents an extensive survey of techniques and technologies used to implement planar magnetic structures in modern dc to de converters. The survey emphasises the practical applications of these devices. The trends are analyzed in the context of the marketplace and some predictions of future direction are attempted.

The integration of power inductors is a roadblock in realizing highly miniaturized power supply in package (PSiP) and power supply on chip. Inductors in such power systems are used for energy storage and filtering, but they dominate in size and loss. This paper presents a novel three-dimensional in-silicon through-silicon via (TSV) magnetic-core toroidal inductor for PSiP. The magnetic powder based core is embedded into a TSV air-core inductor using a casting method. The unique air-core inductor design with a hollow core and suspended windings enables a complete core filling with microscale magnetic powders. The proposed casting method is simple, scalable, and generic for a wide range of magnetic powders. TSV magnetic-core inductors are fabricated in a compact size of 2.4 mm × 2.4 mm × 0.28 mm with the core content varying from 63 to 88 wt% of soft ferrite NiZn powders. The TSV magnetic-core toroidal inductors are fabricated and electrically characterized. Small-signal measurements show a threefold higher inductance of 112 nH and a 30% higher quality factor of 14.3 at 12.5 MHz for magnetic-core inductors compared with similar TSV air-core inductors. The small-signal measurement results are verified by the modeled results. The total core loss is characterized by large-signal measurements. A suitable inductor is implemented in a 12-MHz buck converter that operates in a zero-voltage-switching mode. The converter achieves a peak efficiency of 71.6% and an output power of 2.4 W while converting 12 to 5 V _dc .

Microfabricated inductors experience increasing interest and research activity because of their high potential in buck converters for power supply in package and power supply on chip applications. This paper details the modeling and optimization of microfabricated racetrack inductors. The analytical expressions derived characterize inductance, efficiency, and power density based on geometrical parameters, inductor current, and switching frequency. An accurate analysis of the inductor current that includes the impact of losses is performed to determine the switching frequency, the ac copper losses, and the core losses. The presented model is compared to finite element method simulations and reported results of three microfabricated inductors. Finally, the optimum tradeoff between efficiency and power density is identified using the Pareto front, which results from the evaluation of a large number of microfabricated inductors in the design space defined by the application.