Thomas Weissbach

Dr. Thomas Weissbach

Chemnitz University of Technology, Chemnitz, Saxony, Germany
orcid

Research Focus & Metrics

Academic Career Length

9Years (2018-Present)

(Calculated once Scilit publication data is synced: current year − year of first publication + 1)

Representative Publications

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17 April 2018 in Macromolecules
Verified
Journal Article
Closed access
YZYiwei Zheng
Yiwei Zheng
UAUri Ash
Uri Ash
RPRavi P. Pandey
Ravi P. Pandey
AOAmobi G. Ozioko
Amobi G. Ozioko
JPJulia Ponce-González
Julia Ponce-González
DDDario R. Dekel
Dario R. Dekel

1 September 2019 in Journal of Membrane Science
Verified
Journal Article
Closed access
NZNoga Ziv
Noga Ziv
AMAbhishek N. Mondal
Abhishek N. Mondal
TWThomas Weissbach
Thomas Weissbach
SHSteven Holdcroft
Steven Holdcroft
DDDario R. Dekel
Dario R. Dekel

23 September 2021 in Materials
Verified
Journal Article
Open access
PDF file
JMJarne Machiels
Jarne Machiels
RARaf Appeltans
Raf Appeltans
DBDieter Klaus Bauer
Dieter Klaus Bauer
ESElien Segers
Elien Segers
ZHZander Henckens
Zander Henckens
MBMieke Buntinx
Mieke Buntinx
Intelligent packaging is an emerging technology, aiming to improve the standard communication function of packaging. Radio frequency identification (RFID) assisted smart packaging is of high interest, but the uptake is limited as the market needs cost-efficient and sustainable applications. The integration of screen printed antennas and RFID chips as smart labels in reusable cardboard packaging could offer a solution. Although paper is an interesting and recyclable material, printing on this substrate is challenging as the ink conductivity is highly influenced by the paper properties. In this study, the best paper/functional silver ink combinations were first selected out of 76 paper substrates based on the paper surface roughness, air permeance, sheet resistance and SEM characterization. Next, a flexible high frequency RFID chip (13.56 MHz) was connected on top of screen printed antennas with a conductive adhesive. Functional RFID labels were integrated in cardboard packaging and its potential application as reusable smart box for third party logistics was tested. In parallel, a web-based software application mimicking its functional abilities in the logistic cycle was developed. This multidisciplinary approach to developing an easy-scalable screen printed antenna and RFID-assisted smart packaging application is a good example for future implementation of hybrid electronics in sustainable smart packaging.

17 May 2022 in Sensors
Verified
Journal Article
Open access
PDF file
GSGeorg Schmidt
Georg Schmidt
JWJonas Maximilian Werner
Jonas Maximilian Werner
TWThomas Weissbach
Thomas Weissbach
JSJörg Strutwolf
Jörg Strutwolf
RERobert Eland
Robert Eland
AHArved C. Hübler
Arved C. Hübler
With a growing number of electronic devices surrounding our daily life, it becomes increasingly important to create solutions for clear and simple communication and interaction at the human machine interface (HMI). Haptic feedback solutions play an important role as they give a clear direct link and response to the user. This work demonstrates multifunctional haptic feedback devices based on fully printed piezoelectric transducers realized with functional polymers on thin paper substrate. The devices are flexible; lightweight and show very high out-of-plane deflection of 213 µm at a moderate driving voltage of 50 Vrms (root mean square) achieved by an innovative multilayer design with up to five individually controllable active layers. The device creates a very clear haptic sensation to the human skin with a blocking force of 0.6 N at the resonance frequency of 320 Hz, which is located in the most sensitive range of the human fingertip. Additionally the transducer generates audible information above two kilohertz with a remarkable high sound pressure level. Thus the paper-based approach can be used for interactive displays in combination with touch sensation; sound and color prints. The work gives insights into the manufacturing process; the electrical characteristics; and an in-depth analysis of the 3D deflection of the device under variable conditions