Effect of the Zener–Hollomon parameter on the microstructures and mechanical properties of Cu subjected to plastic deformation

Mechanical properties and rolling behaviors of nano-grained copper with embedded nano-twin bundles

Effect of stacking-fault energy on deformation twin thickness in Cu–Al alloys

Effects of stacking fault energy, strain rate and temperature on microstructure and strength of nanostructured Cu–Al alloys subjected to plastic deformation

Effect of thermal annealing on mechanical properties of a nanostructured copper prepared by means of dynamic plastic deformation

A High‐Capacitance Salt‐Free Dielectric for Self‐Healable, Printable, and Flexible Organic Field Effect Transistors and Chemical Sensor