Qidong Wang

Prof. Dr. Qidong Wang

System Packaging and Integration Research Center, Institute of Microelectronics of the Chinese Academy of Sciences, Beijing 100029, China
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Biography

Qidong Wang received a B.S. degree from Southeast University, Nanjing, China, an M.S. degree from the University of Nottingham, Nottingham, U.K., in 2009, and a Ph.D. degree from the University of Chinese Academy of Sciences, Beijing, China, in 2014. In 2009, he joined the Institute of Microelectronics Chinese Academy of Sciences, Beijing, China, as an Assistant Professor, Associate Professor, and Professor in 2009, 2014, and 2020, respectively. Since 2020, he has been the Director of the System Packaging and Integration Research Center. He has been also the Director of the R&D Department of the National Center for Advanced Packaging (NCAP) since 2018 and the Technical Director of NCAP since 2020.

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Experience

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