Xiangyu Fei

Mr. Xiangyu Fei

orcid

Research Focus & Metrics

Academic Career Length

6Years (2021-Present)

(Calculated once Scilit publication data is synced: current year − year of first publication + 1)

Representative Publications

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5 February 2022 in Journal of Materials Research and Technology
Verified
Journal Article
Open access
ZDZhichao Dong
Zhichao Dong
MXMengchen Xu
Mengchen Xu
HGHaowei Guo
Haowei Guo
XFXiangyu Fei
Xiangyu Fei
YLYabo Liu
Yabo Liu
GJGuannan Ju
Guannan Ju

17 February 2023 in Journal of Materials Research and Technology
Verified
Journal Article
Open access
ZDZhichao Dong
Zhichao Dong
XFXiangyu Fei
Xiangyu Fei
LFLiu Feng
Liu Feng
JNJiwei Nie
Jiwei Nie
WLWeijie Li
Weijie Li
BGBenkui Gong
Benkui Gong

23 September 2021 in Materials
Verified
Journal Article
Open access
PDF file
ZDZhichao Dong
Zhichao Dong
XFXiangyu Fei
Xiangyu Fei
BGBenkui Gong
Benkui Gong
XZXinyu Zhao
Xinyu Zhao
JNJiwei Nie
Jiwei Nie
The development of fifth-generation (5G) communication and wearable electronics generates higher requirements for the mechanical properties of copper foil. Higher mechanical properties and lower resistance are required for flexible copper-clad laminate and high-frequency and high-speed Cu foil. Deep cryogenic treatment (DCT), as a post-treatment method, has many advantages, such as low cost and ease of operation. However, less attention has been paid to the impact of DCT on rolled Cu foil. In this study, the effects of DCT on the microstructure and mechanical properties of rolled Cu foil were investigated. The results show that as the treatment time increased, the tensile strength and hardness first increased and then decreased, reaching a peak value of 394.06 MPa and 1.47 GPa at 12 h. The mechanical property improvement of rolled Cu foil was due to the grain refinement and the increase of dislocation density. The dislocation density of rolled Cu foil after a DCT time of 12 h was determined to have a peak value of 4.3798 × 1015 m−2. The dislocation density increased by 19% and the grain size decreased by 12% after 12 h DCT.

21 November 2024 in Materials
Verified
Journal Article
Open access
PDF file
JLJinglei Li
Jinglei Li
BYBin Yu
Bin Yu
YRYunfei Ran
Yunfei Ran
YLYalong Liu
Yalong Liu
XFXiangyu Fei
Xiangyu Fei
Zhonghua ZhangZhonghua Zhang
Zhonghua Zhang
Nanoporous copper (np-Cu) has attracted much more attention due to its lower cost compared to other noble metals and high functionality in practical use. Herein, Al100−xCux(x = 13–88 at.%) precursor films with thicknesses of 0.16–1.1 μm were fabricated by varying magnetron co-sputtering parameters. Subsequently, utilizing a one-step dealloying strategy, a series of np-Cu films with ligament sizes ranging from 11.4–19.0 nm were synthesized. The effects of precursor composition and substrate temperature on the microstructure of np-Cu films were investigated. As the atomic ratio of Cu increases from 15 to 34, the np-Cu film detached from the substrate gradually transforms into a bi-continuous ligament-channel structure that is well bonded to the substrate. Furthermore, the novel bi-layer hierarchical np-Cu films were successfully prepared based on single-layer nanoporous films. Our findings not only contribute to the systematic understanding of the modification of the morphology and structure of np-Cu films but also offer a valuable framework for the design and fabrication of other non-noble nanoporous metals with tailored properties.