The recently introduced photothermoelectric (PTE) effect is proposed as an alternative for measuring dynamic thermal parameters of solid samples. The front PTE configuration, together with the thermal-wave resonator cavity method as a scanning procedure, was used to measure the value of thermal effusivity. The back PTE configuration, together with the chopping frequency of incident radiation as a scanning parameter, leads to the direct measurement of thermal diffusivity. A theory based on the above two detection configurations was developed and its application to solids, covering a large range of typical values of thermal parameters (aluminum and copper alloys, glass, teflon, polyethylene, LiTaO3), was described in order to demonstrate the suitability of the method. Experimental support for other well-known techniques (photopyroelectric and infrared lock-in thermography) has validated the results obtained with the novel method.

In this work, a new method to characterize vertical cracks by lock-in thermography is presented. The heat transfer process induced by a modulated thermal excitation located in the vicinity of the crack is simulated using a finite element method computer package. The propagation of heat flow along the solid surface is disturbed when crossing an inhomogeneity. The disturbance of the thermal-wave allows a quantitative analysis of the crack. The main idea consists of exploiting the second derivative of the amplitude image in order to highlight the useful signal. In addition, an image analysis procedure based on the use of Laplacian calculations is proposed. To support this approach, experimental tests were performed and compared with mathematical simulations. The results demonstrate the potential of active lock-in thermography as a contactless tool for crack-depth estimation.