Recent development of group-IV alloy GeSn indicates its bright future for the application of mid-infrared Si photonics. Relaxed GeSn with high material quality and high Sn composition is highly desirable to cover mid-infrared wavelength. However, its crystal growth remains a great challenge. In this work, a systematic study of GeSn strain relaxation mechanism and its effects on Sn incorporation during the material growth via chemical vapor deposition was conducted. It was discovered that Sn incorporation into Ge lattice sites is limited by high compressive strain rather than historically acknowledged chemical reaction dynamics, which was also confirmed by Gibbs free energy calculation. In-depth material characterizations revealed that: (i) the generation of dislocations at Ge/GeSn interface eases the compressive strain, which offers a favorably increased Sn incorporation; (ii) the formation of dislocation loop near Ge/GeSn interface effectively localizes defects, leading to the subsequent low-defect grown GeSn. Following the discovered growth mechanism, a world-record Sn content of 22.3% was achieved. The experiment result shows that even higher Sn content could be obtained if further continuous growth with the same recipe is conducted. This report offers an essential guidance for the growth of high quality high Sn composition GeSn for future GeSn based optoelectronics.

Low-cost shortwave infrared detectors have great potential for emerging civilian night-vision applications. This paper reports the characteristics of Ge_0.89Sn_0.11 photodiodes monolithically grown on a Si substrate that holds great promise for those applications. At room temperature, the 500 μm diameter active area device demonstrated a longwave cutoff of 2.65 μm and a responsivity of 0.32 A/W at 2 μm, which corresponds to an external quantum efficiency of 20% without any contribution from the Ge buffer layer. The measured peak specific detectivity at 300 K and 77 K is 1.7 × 10⁹ Jones and 4.3 × 10⁹ Jones, respectively. The specific detectivity at 77 K is only one-order-of-magnitude lower than that of the market dominating extended-InGaAs photodiode. The detailed device analysis indicated that the 700-nm thick fully relaxed high-quality GeSn absorbing layer and the modified depletion region lead to the above-mentioned device performance.

We demonstrate that the atom chain structure of Te allows it to be exfoliated as ultra-thin flakes and nanowires. Atomic force microscopy of exfoliated Te shows that thicknesses of 1–2 nm and widths below 100 nm can be exfoliated with this method. The Raman modes of exfoliated Te match those of bulk Te, with a slight shift (4 cm−1) due to a hardening of the A1 and E modes. Polarized Raman spectroscopy is used to determine the crystal orientation of exfoliated Te flakes. These experiments establish exfoliation as a route to achieve nanoscale trigonal Te while also demonstrating the potential for fabrication of single atom chains of Te.

The recent demonstration of the GeSn laser opened a promising route towards the monolithic integration of light sources on the Si platform. A GeSn laser with higher Sn content is highly desirable to enhance the emission efficiency and to cover longer wavelength. This Letter reports optically pumped edge-emitting GeSn lasers operating at 3 μm, whose device structure featured Sn compositionally graded with a maximum Sn content of 22.3%. By using a 1950-nm laser pumping in comparison with a 1064-nm pumping, the local heating and quantum defect were effectively reduced, which improved laser performance in terms of higher maximum lasing temperature and lower threshold.

In this work, all group-IV band-to-band lasers based on SiGeSn/GeSn/SiGeSn multi-quantum-well structures were demonstrated. Lasing performance was investigated via two 4-well samples. The thinner GeSn well sample exhibits a maximum lasing temperature of 20 K and a threshold of 55 kW/cm² at 10 K, while the thicker well sample features a higher maximum operating temperature of 90 K and lower lasing thresholds of 25 and 62 kW/cm² at 10 and 77 K, respectively. The distinct results were tentatively interpreted mainly by the difference of gain volume. This result provides guidance for the future GeSn quantum well laser optimization for higher performance.

Ge _1-x Sn _x photodetectors (PDs) have emerged as a new type of mid-infrared (MIR) CMOS-compatible PDs for a wide range of applications. Here we present a comprehensive theoretical study to evaluate the achievable performance of Ge _1-x Sn _x p-i-n homojunction PDs with strain-free and defect-free Ge _1-x Sn _x active layer for the purpose of demonstrating its potential in advancing the MIR detection technology. Starting from the Sn-composition-dependent band structures, the theoretical model calculates optical absorption, responsivity, dark current density, and detectivity. The results show that the optical responsivity can be enhanced with the Sn incorporation due to the improved optical absorption and the large mobilities and diffusion lengths of the photo-generated electrons and holes. The dark current density, however, increases with the increasing Sn composition. Our model suggests that not only the photodetection range of the Ge _1-x Sn _x PDs can be extended to the MIR region but their detectivity at room temperature can be competitive with the existing MIR technology, and in some cases better than some commercial PDs operating at lower temperatures. This study establishes the ultimate performance that can be potentially achieved with the Ge _1-x Sn _x MIR technology with the maturity of its material development in due time in addition to its much anticipated CMOS-compatible advantages.