Semi-crystalline polymers develop higher amounts of residual stress and part distortion (warpage) compared to amorphous polymers due to their crystalline nature. Additionally, the FDM processing parameters such as ambient temperature play an important role in the resulting residual stresses and part distortion of the printed part. Hence, in this study, the effect of ambient temperature on the in-built residual stresses and warpage of amorphous acrylonitrile-butadiene-styrene (ABS) and semi-crystalline polypropylene (PP) polymers was investigated. From the results, it was observed that increasing the ambient temperature from 50 °C to 75 °C and further to 120 °C resulted in 0.22-KPa and 0.37-KPa decreases in residual stress of ABS, but no significant change in the amount of warpage. For PP, increasing ambient temperature from 50 °C to 75 °C led to a more considerable decrease in residual stress (0.5 MPa) and about 3% increase in warpage. Further increasing to 120 °C resulted in a noticeable 2 MPa decrease in residual stress and a 3.4% increase in warpage. Reduction in residual stress in both ABS and PP as a result of increasing ambient temperature was due to the reduced thermal gradients. The enhanced warpage in PP with increase in ambient temperature, despite the reduction in residual stress, was ascribed to crystallization and shrinkage.

In fused deposition modelling (FDM) based on the selected raster pattern, the developed internal thermal residual stresses can vary considerably affecting the mechanical properties and leading to distinct part distortions. This phenomenon is more pronounced in semi-crystalline than amorphous polymers due to crystallisation. Hence, this study focuses on the simulation of the FDM process of a semi-crystalline polymer (polypropylene) with raster patterns such as line (90°/90°), line (0°/90°), zigzag (45°/45°), zigzag (45°/−45°), and concentric from Cura (slicing software). The simulation provides visualisation and prediction of the internally developed thermal residual stresses and resulting warpage with printing time and temperature. The sample with a line (90°/90°) raster pattern is considered as the reference sample in order to compare the relative levels of residual stress and warpage in the other printed/simulated samples. Among the considered raster patterns, the concentric pattern displays the lowest amount of warpage (5.5% decrease) along with a significant drop in residual stress of 21%. While the sample with a zigzag (45°/−45°) pattern showed the highest increase of 37% in warpage along with a decrease of 9.8% in residual stresses. The sample with a zigzag (45°/45°) pattern, exhibited a considerable increase of 16.2% in warpage with a significant increase of 31% in residual stresses. Finally, the sample with a line (0°/90°) raster pattern displayed an increase of 24% increase in warpage with an increase of 6.6% in residual stresses.