Taho Yang

Prof. Taho Yang

Institute of Manufacturing Information and Systems, National Cheng Kung University, Tainan 70101, Taiwan
orcid

Research Focus & Metrics

Academic Career Length

33Years (1994-Present)

(Calculated once Scilit publication data is synced: current year − year of first publication + 1)

Representative Publications

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1 August 2008 in Computers & Industrial Engineering
Verified
Journal Article
Closed access
YKYiyo Kuo
Yiyo Kuo
Taho YangTaho Yang
Taho Yang
GHGuan-Wei Huang
Guan-Wei Huang

1 February 2007 in Robotics and Computer-Integrated Manufacturing
Verified
Journal Article
Closed access
Taho YangTaho Yang
Taho Yang
CHChih-Ching Hung
Chih-Ching Hung

1 May 2003 in European Journal of Operational Research
Verified
Journal Article
Closed access
Taho YangTaho Yang
Taho Yang
CKChunwei Kuo
Chunwei Kuo

20 May 2008 in Engineering Optimization
Verified
Journal Article
Closed access
YKYiyo Kuo
Yiyo Kuo
Taho YangTaho Yang
Taho Yang
GHGuan-Wei Huang
Guan-Wei Huang
Simulation modelling is a widely accepted tool in system design and analysis, particularly when the system or environment has stochastic and nonlinear behaviour. However, it does not provide a method for optimization. In general, problems contain more than one response, which are often in conflict with each other. This article proposes a grey-based Taguchi method to solve the multi-response simulation problem. The grey-based Taguchi method is based on the optimizing procedure of the Taguchi method, and adopts grey relational analysis (GRA) to transfer multi-response problems into single-response problems. A practical case study from an integrated-circuit packaging company illustrates that differences in performance of the proposed grey-based Taguchi method and other methods found in the literature were not significant. The grey-based Taguchi method thus provides a new option when solving a multi-response simulation-optimization problem.

1 February 2005 in Mathematics and Computers in Simulation
Verified
Journal Article
Closed access
Taho YangTaho Yang
Taho Yang
PCPohung Chou
Pohung Chou

7 August 2002 in IEEE Transactions on Semiconductor Manufacturing
Verified
Journal Article
Closed access
CSChao-Ton Su
Chao-Ton Su
Taho YangTaho Yang
Taho Yang
CKChir-Mour Ke
Chir-Mour Ke
Semiconductor wafer post-sawing requires full inspection to assure defect-free outgoing dies. A defect problem is usually identified through visual judgment by the aid of a scanning electron microscope. By this means, potential misjudgment may be introduced into the inspection process due to human fatigue. In addition, the full inspection process can incur significant personnel costs. This research proposed a neural-network approach for semiconductor wafer post-sawing inspection. Three types of neural networks: backpropagation, radial basis function network, and learning vector quantization, were proposed and tested. The inspection time by the proposed approach was less than one second per die, which is efficient enough for a practical application purpose. The pros and cons for the proposed methodology in comparison with two other inspection methods, visual inspection and feature extraction inspection, are discussed. Empirical results showed promise for the proposed approach to solve real-world applications. Finally, we proposed a neural-network-based automatic inspection system framework as future research opportunities.