Structural health monitoring of lightweight constructions made of composite materials can be performed using guided ultrasonic waves. If modern fiber metal laminates are used, this requires integrated sensors that can record the inner displacement oscillations caused by the propagating guided ultrasonic waves. Therefore, we developed a robust MEMS vibrometer that can be integrated while maintaining the structural and functional compliance of the laminate. This vibrometer is directly sensitive to the high-frequency displacements from structure-borne ultrasound when excited in a frequency range between its first and second eigenfrequency. The vibrometer is mostly realized by processes earlier developed for a pressure sensor but with additional femtosecond laser ablation and encapsulation. The piezoresistive transducer, made from silicon, is encapsulated between top and bottom glass lids. The eigenfrequencies are experimentally determined using an optical micro vibrometer setup. The MEMS vibrometer functionality and usability for structural health monitoring are demonstrated on a customized test rig by recording application-relevant guided ultrasonic wave packages with a central frequency of 100 kHz at a distance of 0.2 m from the exciting ultrasound transducer.

Current research in the field of aviation considers actively controlled high-lift structures for future civil airplanes. Therefore, pressure data must be acquired from the airfoil surface without influencing the flow due to sensor application. For experiments in the wind and water tunnel, as well as for the actual application, the requirements for the quality of the airfoil surface are demanding. Consequently, a new class of sensors is required, which can be flush-integrated into the airfoil surface, may be used under wet conditions—even under water—and should withstand the harsh environment of a high-lift scenario. A new miniature silicon on insulator (SOI)-based MEMS pressure sensor, which allows integration into airfoils in a flip-chip configuration, is presented. An internal, highly doped silicon wiring with “butterfly” geometry combined with through glass via (TGV) technology enables a watertight and application-suitable chip-scale-package (CSP). The chips were produced by reliable batch microfabrication including femtosecond laser processes at the wafer-level. Sensor characterization demonstrates a high resolution of 38 mVV⁻¹ bar⁻¹. The stepless ultra-smooth and electrically passivated sensor surface can be coated with thin surface protection layers to further enhance robustness against harsh environments. Accordingly, protective coatings of amorphous hydrogenated silicon nitride (a-SiN:H) and amorphous hydrogenated silicon carbide (a-SiC:H) were investigated in experiments simulating environments with high-velocity impacting particles. Topographic damage quantification demonstrates the superior robustness of a-SiC:H coatings and validates their applicability to future sensors.

Structural health monitoring systems for composite laminates using guided ultrasonic waves become more versatile with the structural integration of sensors. However, the data generated within these sensors have to be transmitted from the laminate to the outside, where polyimide-based printed circuit boards play a major role. This study investigates, to what extent integrated polyimide inlays with applied sensor bodies influence the guided ultrasonic wave propagation in glass fiber-reinforced polymer specimens. For reasons of resource efficiency, narrow specimens are used. Numerical simulations of a damping-free specimen indicate reflections of the $S_0$-mode at the integrated inlay. This is validated experimentally with an air-coupled ultrasonic technique and a 3D laser Doppler vibrometry measurement. The experimental data are evaluated with a method including temporal and spatial continuous wavelet transformations to clearly identify periodically occurring wave packages as edge reflections and distinguish them from possible inlay reflections. However, even when separating in-plane and out-of-plane movements using the 3D measurement, no reflections at the inlays are detected. This leads to the conclusion that polyimide inlays are well suited as substrates for printed circuit boards integrated into fiber-reinforced polymer structures for structural health monitoring, since they do not significantly influence the wave propagation.

This paper describes and evaluates the embedding of sensors and electronic sensor nodes into fiber metal laminate (FML) plates to achieve material-integrated, guided ultrasonic wave based structural health monitoring for hybrid materials. It evaluates how embedded electronics can enhance the process of sensor data acquisition and at the same time critically investigates the drawbacks that accompany the embedding approach regarding the influence on the received signal. A FML specimen with single sensors in one half of the plate and sensors with attached electronic sensor nodes for wireless readout in the other half is manufactured, introducing the detailed embedding process for such systems. Ultrasonic through-thickness scans of the manufactured plate are presented and analyzed to assess the achieved embedding quality. Together with electric sensor signals from both, wireless and wirebound micro-electromechanical system vibrometers and data from a scanning laser Doppler vibrometer (SLDV) the influence of material-integrated components on the wave propagation around the locations of integration is discussed. Further, the signals of wirebound sensors are successfully correlated with measurements performed using the SLDV and directly compared to data provided by wirelessly readout sensor nodes having the same type of sensor attached. This work shows how reflections occurring due to a material integration of components influence the recorded sensor data. At the same time, it is discussed how, for baseline-based damage detection methods, the influence of this is assumed to be a minor problem, and proof for advantages provided by the integration of complete sensor systems directly into the host material is provided.

Guided ultrasonic wave-based structural health monitoring utilizes propagating elastic waves to identify, locate, and characterize damage within aviation structures. Fiber metal laminates, which are composite materials made by layering metal sheets with fiber-reinforced polymers, combine the high strength of composites with the ductility and impact resistance of metals. However, structural health monitoring methods suitable for these materials have to be developed, allowing to monitor also the inner laminate layers. Therefore, laminate-embedded MEMS vibrometers have been introduced recently. Due to the quasi-free operation of these inertial sensors, they are directly sensitive to the displacement induced by propagating guided ultrasonic waves. However, the multimodal excitation of the sensor’s core resonator, when exposed to ultrasound bursts, leads to a pseudo-nonlinear sensor response, which is attributed to the spectrum of guided ultrasonic waves and their interference with higher harmonics of the continuum resonator. The transfer behavior of the sensor can be improved by implementing electrical mode suppression. This research involves analytically modeling the continuous resonator with multiple aggregated resonators, numerically simulating sensor responses to 100 kHz ultrasound bursts, and using a laser scanning micro vibrometer setup for experimental validation, providing a deeper understanding of MEMS vibrometer dynamics for ultrasonic monitoring and demonstrating their applicability.