Purpose: This study aims to analyze the shear strength and fracture mechanism of full Cu-Sn IMCs joints with different Cu₃Sn proportion and joints with the conventional interfacial structure in electronic packaging. Design/methodology/approach: The Cu-Sn IMCs joints with different Cu₃Sn proportion were fabricated through soldering Cu-6 μm Sn-Cu sandwich structure under the extended soldering time and suitable pressure. The joints of conventional interfacial structure were fabricated through soldering Cu-100 μm Sn-Cu sandwich structure. After the shear test was conducted, the fracture mechanism of different joints was studied through observing the cross-sectional fracture morphology and top-view fracture morphology of sheared joints. Findings: The strength of joints with the conventional interfacial structure was 26.6 MPa, while the strength of full Cu-Sn IMCs joints with 46.7, 60.6, 76.7 and 100 per cent Cu₃Sn was, respectively, 33.5, 39.7, 45.7 and 57.9 MPa. The detailed reason for the strength of joints showing such regularity was proposed. For the joint of conventional interfacial structure, the microvoids accumulation fracture happened within the Sn solder. However, for the full Cu-Sn IMCs joint with 46.7 per cent Cu₃Sn, the cleavage fracture happened within the Cu6Sn5. As the Cu₃Sn proportion increased to 60.6 per cent, the inter-granular fracture, which resulted in the interfacial delamination of Cu₃Sn and Cu6Sn5, occurred along the Cu₃Sn/Cu6Sn5 interface, while the cleavage fracture happened within the Cu6Sn5. Then, with the Cu₃Sn proportion increasing to 76.7 per cent, the cleavage fracture happened within the Cu6Sn5, while the transgranular fracture happened within the Cu₃Sn. The inter-granular fracture, which led to the interfacial delamination of Cu₃Sn and Cu, happened along the Cu/Cu₃Sn interface. For the full Cu₃Sn joint, the cleavage fracture happened within the Cu₃Sn. Originality/value: The shear strength and fracture mechanism of full Cu-Sn IMCs joints was systematically studied. A direct comparison regarding the shear strength and fracture mechanism between the full Cu-Sn IMCs joints and joints with the conventional interfacial structure was conducted.

Purpose: The purpose of this paper is to investigate the diffusion behaviors of different atoms at the Cu/Cu3Sn interface and the vacancy formation energy, diffusion energy barrier and vacancy diffusion activation energy. Design/methodology/approach: The diffusion behaviors of different atoms at the Cu/Cu3Sn interface are analyzed, and the vacancy formation energy, diffusion energy barrier and vacancy diffusion activation energy are obtained using molecular dynamics simulation. The nudged elastic band method is used to evaluate diffusion energy barrier for Cu/Cu3Sn system. Findings: It is found that the vacancies in the Cu/Cu3Sn interface promote the interfacial diffusion, and the formation energy of Cu vacancy in the Cu crystal is larger than that in Cu3Sn crystal. In addition, the formation energies of Cu1 vacancy and Cu2 vacancy are close to each other in Cu3Sn crystal, and they are all less than the formation energy of Sn vacancy. Furthermore, the vacancy diffusion barrier and vacancy diffusion activation energy of the Cu/Cu3Sn interface are calculated, and the results show that the vacancy diffusion activation energy of Sn was higher than that of Cu. Finally, by comparison of diffusion activation energies of different diffusion mechanisms, Cu→Cu1vac is the most possible migration path at all temperatures. Originality/value: It is concluded that the vacancies in Cu/Cu3Sn interface promote interfacial diffusion, and the activation energy of vacancy diffusion in most diffusion mechanisms decreases with the increase of temperature.

Purpose: This paper aims to analyze the morphology transformation on the Cu₃Sn grains during the formation of full Cu₃Sn solder joints in electronic packaging. Design/methodology/approach: Because of the infeasibility of analyzing the morphology transformation intuitively, a novel equivalent method is used. The morphology transformation on the Cu₃Sn grains, during the formation of full Cu₃Sn solder joints, is regarded as equivalent to the morphology transformation on the Cu₃Sn grains derived from the Cu/Sn structures with different Sn thickness. Findings: During soldering, the Cu₃Sn grains first grew in the fine equiaxial shape in a ripening process until the critical size. Under the critical size, the Cu₃Sn grains were changed from the equiaxial shape to the columnar shape. Moreover, the columnar Cu₃Sn grains could be divided into different clusters with different growth directions. With the proceeding of soldering, the columnar Cu₃Sn grains continued to grow in a feather of the width growing at a greater extent than the length. With the growth of the columnar Cu₃Sn grains, adjacent Cu₃Sn grains, within each cluster, merged with each other. Next, the merged columnar Cu₃Sn grains, within each cluster, continued to merge with each other. Finally, the columnar Cu₃Sn grains, within each cluster, merged into one coarse columnar Cu₃Sn grain with the formation of full Cu₃Sn solder joints. The detailed mechanism, for the very interesting morphology transformation, has been proposed. Originality/value: Few researchers focused on the morphology transformation of interfacial phases during the formation of full intermetallic compounds joints. To bridge the research gap, the morphology transformation on the Cu₃Sn grains during the formation of full Cu₃Sn solder joints has been studied for the first time.