Cheolung Cha

Dr. Cheolung Cha

Korea Electronics Technology Institute

Research Focus & Metrics

Academic Career Length

21Years (2006-Present)

(Calculated once Scilit publication data is synced: current year − year of first publication + 1)

Representative Publications

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29 December 2021 in Sensors
Verified
Journal Article
Open access
PDF file
YHYong Ki Heo
Yong Ki Heo
JKJinhyung Kim
Jinhyung Kim
Cheolung ChaCheolung Cha
Cheolung Cha
Kyu-Sik ShinKyu-Sik Shin
Kyu-Sik Shin
JRJihyoung Roh
Jihyoung Roh
JJJung Ki Jo
Jung Ki Jo
Erection measurements are the most important indicator of male urological disease diagnosis, treatment, and results. Rigiscan has been used widely in studies and diagnoses for nocturnal penile tumescence for evaluating erectile dysfunction by measuring the number and timing of erectile dysfunctions during sleep. However, this device has limitations such as the weight and bulk of the device and has been questioned for its role as a standard for ED Erectile Dysfunction (ED) diagnosis. In this study, we propose a real-time wearable monitoring system that can quantitatively measure the length and circumference of the penis using electronic textiles (E-textile) and carbon nanotube (CNT) sensors. The E-textile sensor is used to measure the length, circumference, and gradient with portability, convenience, and comfort. Sensors were created by coating CNTs on latex for flexibility. The CNT-based latex condom-type sensor in our proposed system shows the length, circumference, and curvature measurements with changes in resistance, and the E-textile performance shows a 1.44% error rate and a cavity radius of 110 to 300. The results of this conceptual study are for supplementary sensor development with a combination of new technologies with alternatives or existing methods for measuring erection function.

14 July 2017 in PHM Society Asia-Pacific Conference
Verified
Journal Article
Open access
PDF file
DLDongoh Lee
Dongoh Lee
XZXing Guan Zhao
Xing Guan Zhao
KHKyung-Jun Hwang
Kyung-Jun Hwang
Cheolung ChaCheolung Cha
Cheolung Cha
BYBumjin Yoon
Bumjin Yoon
NKNamsu Kim
Namsu Kim
Recycling of filaments used in 3-D printing system is beneficial to both the environment and and its manucactures by reducing manufacturing costs. This study investigates how multiple-recycled poly-lactic acid (PLA) filamentsaffects mechanical properties of fabricated objects.. Mechanical strengths of the printed PLA, as well as the adhesion strengths between 3-D-printed beads, were evaluated by tensile tests of horizontally and vertically fabricated specimens. The mechanical strength of the printed PLA as well as the adhesion strength between 3-Dprinted beads were determined through tensile testing of horizontally and vertically fabricated specimens. Subsequent gel permeation chromatography revealed that recycling reduced the molecular weight of the polymer, leading to a loss of mechanical strength in the 3D-printed component. In addition, images of cutting plane using scanning electron microscopy showed that the fabricated bead itself was broken in the case of the horizontally fabricated specimen, while in the case of the vertically fabricated one, the adhered between the beads was found to be broken. This indicates that the mechanical strength of inplane and out-of-plane direction should be improved by increasing mechanical strength of bead, itself, as well as the adhesion strength between beads.

1 October 2006
Verified
Conference Paper
Closed access
Cheolung ChaCheolung Cha
Cheolung Cha
YLYunsik Lee
Yunsik Lee
SSSang-Woo Seo
Sang-Woo Seo
NJNan M. Jokerst
Nan M. Jokerst
MBMartin A. Brooke
Martin A. Brooke
Parasitic capacitance analysis of an ultra thin-film metal-semiconductor-metal (MSM) photodetector (PD) having the lowest capacitance per unit surface area is reported in this paper. Through cladding layers removing process using etching, 50-60 % decrease in the parasitic capacitance of the MSM photodetectors, compared to the conventional inverted thin-film MSM photodetectors, was obtained. The parasitic capacitance of the MSM photodetectors depending on etching time was optimized and analyzed using RF modeling techniques in this report.