The main features of electrochemical deposition of coatings based on Ni–W binary alloy in the pulse current mode using pyrophosphate electrolytes were studied. Two electrolytes with a pH of 8.7 and 9.5 were used. The deposition was carried out with the current density varying in the range of 0.01–0.1 A·cm−2, and the duty cycle (the relative pulse duration) was changed within the range 20–100%. The surface morphology and elemental and phase composition of the coatings were studied by scanning electron microscopy, energy-dispersive X-ray microanalysis and X-ray diffractometry. The experimental conditions allowing us to achieve the maximum Faradaic efficiency and W content in the coatings were determined. It was found that the pulse current mode enabled the fabrication of crack-free coatings with a thickness greater than 6 μm.
Switching properties of contact coatings based on ruthenium nanofilms obtained by electrochemical deposition have been studied. The laws of variation of the contact resistance as a function of the...
The formation of a copper coating on a nickel substrate upon the electrical explosion of a conductor in the presence of an external magnetic field is studied. The effect of a magnetic field on the...
1 May 2017 in Journal of Physics: Conference Series
Process of electrochemical deposition of the coating based on a binary nickel-molybdenum alloy onto a nickel substrate under pulse mode with current reverse within the range of current density change from 2 to 9 A/dm2 has been researched. Coating structure and its surface morphology have been studied. Method of X-ray energy dispersive spectroscopy has determined a percentage ratio of alloy components in the coating. Mode to obtain the densest and smoothest deposits has been identified under considered terms.
The work presents the data of numerical modeling of silicon vacuum refining at different temperatures under electromagnetic stirring for purification of large volumes of silicon (≈500 kg). Time dependencies of the concentration decrease of impurities (P, Al, Ca, Zn, Na and Cu) at different rates of electromagnetic stirring and silicon melt temperatures are obtained. The influence of the silicon melt temperature on the purification efficiency rate is established. The numerical studies are performed by COMSOL Multiphysics.